单电子晶体管的进展

X. Jehl, M. Sanquer
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引用次数: 3

摘要

单电子晶体管(set)的大规模生产现在可以使用标准的全耗尽SOI工艺。虽然目前工作温度限制在大约10 K,但这为实现片上混合设计提供了新的机会,将库仑阻塞的优点与常规的基于fet的电子器件相结合。此外,由于开关能量和开关速度之间的必要妥协,CMOS器件的不断缩小倾向于弥合fet和set之间的差距。设计用于极低功耗应用的器件在中等温度下自然具有库仑阻塞,这是由于尺寸非常小且几何形状重叠的结果。一个很有希望的结果是在高频下驱动这种器件的可能性,因为基于fet的嵌入式电子器件可以设计在非常接近SET的地方。与我们的主流微电子方法并行,几个小组最近在高温(高于77 K)硅基set方面取得了重大进展。本文总结了MOS-SET设计的基本特性和性能、电荷灵敏度和显著的长期稳定性以及串联MOS-SET之间的耦合。
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Progress on single-electron transistors
Large scale production of single-electron transistors (SETs) is now possible with a standard fully-depleted SOI process. Although the operating temperature is limited to approximately 10 K for now, this opens new opportunities for implementing on-chip hybrid designs combining the benefits of Coulomb blockade with regular FET-based electronics. Moreover, the continuous shrinking of CMOS devices tends to bridge the gap between FETs and SETs, because of a necessary compromise between switching energy and switching speed. Devices designed for very low power applications will naturally feature Coulomb blockade at moderate temperature, as a result of very small dimensions and underlapped geometry. A promising outcome is the possibility to drive such devices at high frequency, as embedded FET-based electronics can be designed in very close vicinity of the SET. In parallel with our mainstream microelectronics approach, several groups have recently made significant advances towards high temperature (above 77 K) silicon based SETs. In this article we summarize the basic characteristics and behaviour of our MOS-SET design, its charge sensitivity and its remarkable long term stability and the coupling between several MOS-SETs associated in series.
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