晶粒细化对电沉积铜直接结合的影响

2019 International Conference on Electronics Packaging (ICEP) Pub Date : 2019-04-01 DOI:10.23919/ICEP.2019.8733455

Zong-Yu Xie, I-You Yu, Jenn-Ming Song, D. Tarng, C. Hung

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引用次数: 0

摘要

本研究旨在探讨微观结构对铜直接键合的影响。制备了不同晶粒尺寸、择优取向和硬度的电沉积铜样品。我们将研究各个因素的影响，特别是粒度的影响。实验结果表明，通过细化晶粒，可有效提高直连镀铜接头强度30%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Influence of Grain Refinement on Direct Bonding for Electrodeposited Copper

This study aims to investigate microstructural effect on direct Cu bonding. Electro-deposited Cu samples with different grain sizes, preferred orientations as well as hardnesses were prepared. The influence of individual factors will be studied especially grain size. Experimental results show that through grain refinement the strength of directly-bonded electroplated copper joints can be effectively increased by 30%.

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2019 International Conference on Electronics Packaging (ICEP)

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