A. Bôas, M. D. de Melo, R. Santos, R. Giacomini, N. Medina, L. Seixas, F. R. Palomo, M. Guazzelli
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引用次数: 3
摘要
本文研究了总电离剂量(TID)对氮化镓(GaN)晶体管在暴露于辐射之前、期间和之后的影响,以及在辐射暴露期间偏置与不偏置之间的比较。这些高电子迁移率晶体管(hemt)暴露在10 kev x射线有效能量下,并在受控温度环境中进行测试。辐射剂量变化很大,可达350克拉。结果表明,所分析的器件(商用现成(COTs) GaN - GS61008T)受电离辐射的影响很小,并且可以恢复其电气特性,特别是在导通模式下,这表明它们是恶劣环境下使用的良好候选器件。
Assessment of Ionizing Radiation Hardness of a GaN Field-Effect Transistor
This work addresses the effects of Total Ionizing Dose (TID) on a Gallium Nitride (GaN) transistor before, during and after exposing to radiation, and also the comparison between biasing or not, during radiation exposition. These High Electron Mobility Transistors (HEMTs) were exposed to 10-keV X-rays effective energy and tested in a controlled temperature environment. Radiation doses varied in a wide range up to 350 krad. The results show that the devices analyzed, the commercial off-the-shelf (COTs) GaN - GS61008T, suffer few effects of ionizing radiation, and recover their electrical characteristics, especially when in on-state mode, indicating they are good candidates for use in harsh environments.