Koutaro Kikukawa, Natsuki Sugaya, Shigeru Ohno, Y. Tomita
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Quantitative Evaluation of Bonded Silicon Wafer by Scanning Acoustic Tomography
In this paper, we report the results of a quantitative evaluation of the resolution and detectability on images obtained by SAT through silicon wafers with the thicknesses of 775 and 100 µm by transducers with the most appropriate focal length.
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