半绝缘100mm直径InP衬底的VGF晶体生长和气相Fe掺杂技术

T. Asahi, M. Uchida, K. Kainosho, O. Oda
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引用次数: 2

摘要

在挥发性FeP/亚2/气氛下对未掺杂的导电硅片进行退火处理,得到了直径为100mm的半绝缘InP衬底。采用高压炉VGF法生长未掺杂晶体。在这种生长方法中,我们通过计算机模拟研究了降低温度波动以防止孪生的方法。模拟结果表明,改进热区后,晶种附近的温度波动从/spl plusmn/0.3/spl°C减小到/spl plusmn/0.03/spl°C。半绝缘InP通常是在晶体生长过程中由Fe掺杂产生的。在传统的掺杂方法中,由于InP中的铁偏析,铁浓度沿生长轴变化。为了获得良好的晶片间Fe浓度均匀性,我们开发了一种新的Fe掺杂技术,即在挥发性FeP/亚2/气氛下对晶片进行退火。在这项工作中,我们将这种Fe掺杂技术应用于直径为100mm的InP衬底,可以获得大直径的半绝缘衬底。
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VGF crystal growth and vapor-phase Fe doping technologies for semi-insulating 100 mm diameter InP substrates
100 mm diameter <100> semi-insulating InP substrates were obtained after conductive undoped wafers were annealed under volatile FeP/sub 2/ atmosphere. Undoped crystals were grown by the VGF method using a high pressure furnace. In this growth method, we investigated the reduction of the temperature fluctuation by computer simulation for preventing twinning. The temperature fluctuation near the seed crystal could be reduced from /spl plusmn/0.3/spl deg/C to /spl plusmn/0.03/spl deg/C after improvement of the hot-zone, based on the simulation results. Semi-insulating InP is conventionally produced by Fe doping during crystal growth. In the conventional doping method, the Fe concentration is varied along the growth axis due to Fe segregation in InP. In order to obtain good homogeneity of Fe concentrations from wafer to wafer, we have developed a new Fe doping technology in which wafers are annealed under volatile FeP/sub 2/ atmosphere. In this work, we applied this Fe doping technology to 100 mm diameter <100> InP substrates and could obtain large diameter semi-insulating substrates.
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