Yan Liu, Jing Yan, G. Han, Hongjuan Wang, Mingshan Liu, Chunfu Zhang, B. Cheng, Y. Hao
{"title":"应变Ge0.96Sn0.04 p沟道mosfet与原位低温Si2H6表面钝化","authors":"Yan Liu, Jing Yan, G. Han, Hongjuan Wang, Mingshan Liu, Chunfu Zhang, B. Cheng, Y. Hao","doi":"10.1109/ISTDM.2014.6874637","DOIUrl":null,"url":null,"abstract":"We developed process flow for GeSn pMOSFET fabrication with in situ low temperature Si<sub>2</sub>H<sub>6</sub> passivation module. High performance Ge<sub>0.96</sub>Sn<sub>0.04</sub> pMOSFETs were fabricated. At a Q<sub>mv</sub> of 6×10<sup>12</sup> cm<sup>-2</sup>, a 24% enhancement in μ<sub>eff</sub> is demonstrated in Ge<sub>0.96</sub>Sn<sub>0.04</sub> pMOSFETs compared to Ge control.","PeriodicalId":371483,"journal":{"name":"2014 7th International Silicon-Germanium Technology and Device Meeting (ISTDM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-06-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Strained Ge0.96Sn0.04 P-channel MOSFETs with in situ low temperature Si2H6 surface passivation\",\"authors\":\"Yan Liu, Jing Yan, G. Han, Hongjuan Wang, Mingshan Liu, Chunfu Zhang, B. Cheng, Y. Hao\",\"doi\":\"10.1109/ISTDM.2014.6874637\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We developed process flow for GeSn pMOSFET fabrication with in situ low temperature Si<sub>2</sub>H<sub>6</sub> passivation module. High performance Ge<sub>0.96</sub>Sn<sub>0.04</sub> pMOSFETs were fabricated. At a Q<sub>mv</sub> of 6×10<sup>12</sup> cm<sup>-2</sup>, a 24% enhancement in μ<sub>eff</sub> is demonstrated in Ge<sub>0.96</sub>Sn<sub>0.04</sub> pMOSFETs compared to Ge control.\",\"PeriodicalId\":371483,\"journal\":{\"name\":\"2014 7th International Silicon-Germanium Technology and Device Meeting (ISTDM)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2014-06-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2014 7th International Silicon-Germanium Technology and Device Meeting (ISTDM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISTDM.2014.6874637\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 7th International Silicon-Germanium Technology and Device Meeting (ISTDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISTDM.2014.6874637","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Strained Ge0.96Sn0.04 P-channel MOSFETs with in situ low temperature Si2H6 surface passivation
We developed process flow for GeSn pMOSFET fabrication with in situ low temperature Si2H6 passivation module. High performance Ge0.96Sn0.04 pMOSFETs were fabricated. At a Qmv of 6×1012 cm-2, a 24% enhancement in μeff is demonstrated in Ge0.96Sn0.04 pMOSFETs compared to Ge control.