具有简单BIST的晶圆级测试阵列,可加快电路可靠性的工艺开发

M. Hsieh, T. Yew, Y. Huang, Y. C. Wang, W. Wang, Y. Lee, J. H. Lee
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引用次数: 1

摘要

在先进技术开发方法的激烈竞争下,传统的耗时方法和理想的压力条件已不能令人满意。在本文中,FinFET高k/金属栅极(HK/MG)技术中具有简单内置自检(BIST)设计的测试阵列的有效性已经在工艺开发周期的早期进行了三个实验,在产品可用于驱动良率和工艺改进之前。对潜在的电路级质量和可靠性风险的早期预警可以为技术进步节省几条主要的弯路。
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Wafer level test arrays with simple BIST to expedite process development for circuit reliability
Conventional time consuming methodology and idealistic stress conditions are no longer satisfactory under fierce competition between advanced technology development approaches. In this paper, the effectiveness of test arrays with simple built-in self-test (BIST) design in FinFET high-k/metal gate (HK/MG) technology have been demonstrated through three experiments performed early in the process development cycle, before products were available to drive yield and process improvements. Early warnings of potential circuit level quality and reliability risk could save several major detours for technology advancement.
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