45纳米以下设计探索的新一代预测技术模型

Wei Zhao, Yu Cao
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引用次数: 532

摘要

预测MOSFET模型是早期电路设计研究的关键。为了准确地预测纳米级CMOS的特性,必须考虑新出现的物理效应,如工艺变化和模型参数之间的物理相关性。此外,跨技术世代的预测应该是平滑的,以便进行连续的外推。在这项工作中,开发了新一代预测技术模型(PTM)来实现这些目标。基于物理模型和前期硅数据,成功生成了用于130nm ~ 32nm工艺节点的块体CMOS PTM。通过调整10个参数,PTM可以很容易地定制,以覆盖广泛的过程不确定性。全面验证了PTM预测的准确性:对于NMOS, Ion的误差为2%,对于PMOS的误差为5%。此外,新的PTM正确地捕获了纳米范围内的工艺灵敏度。政府已为发布PTM设立网页(http://www.eas.asu.edu/~ptm)。
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New generation of predictive technology model for sub-45nm design exploration
Predictive MOSFET model is critical for early circuit design research. To accurately predict the characteristics of nanoscale CMOS, emerging physical effects, such as process variations and physical correlations among model parameters, must be included. In addition, predictions across technology generations should be smooth to make continuous extrapolations. In this work, a new generation of predictive technology model (PTM) is developed to accomplish these goals. Based on physical models and early stage silicon data, PTM of bulk CMOS for 130nm to 32nm technology nodes is successfully generated. By tuning ten parameters, PTM can be easily customized to cover a wide range of process uncertainties. The accuracy of PTM predictions is comprehensively verified: for NMOS, the error of Ion is 2% and for PMOS, it is 5%. Furthermore, the new PTM correctly captures process sensitivities in the nanometer regime. A webpage has been established for the release of PTM (http://www.eas.asu.edu/~ptm)
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