基于实验与建模结果耦合的包装界面强度确定方法

D. Weidmann, G. Dubois, M. Hertl, X. Chauffleur
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引用次数: 6

摘要

本文的目的是介绍我们在确定包中的接口强度方面所做的工作。该工作包括在包装上获得的耦合实验和建模结果。提出的方法非常有趣,因为它可以直接应用于制造领域中实现的每一个封装设计。该过程包括在某些轴上切割包装,以产生不同的应力区。研究了TDM切割前后的包件,得到了包件的变形历史。然后我们还使用SAM,这是一个允许脱键定位的过程。通过对模拟实验数据的匹配和拟合,我们成功地确定了未知属性。
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Determination of strength of interface in packages based on an approach using coupling of experimental and modeling results
The aim of this paper is to present the work we realized to determinate the strength of interfaces in a package. The work consisted of coupling experimental and modelling results obtained on the package. The proposed method is very interesting because it can be directly applied on every package design realized in the field of manufacturing. The process consists of cutting the package in some axes in order to create different stress zones. We study the package before and after cutting by TDM, which provides us the deformation history of the package. Then we also use SAM, a process which allows debonding localisation. By matching and fitting experimental data on simulation, we succeed in determining unknown properties.
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