高压栅-氧化物脉冲对SiC mosfet BTI性能的影响

S. Maaß, H. Reisinger, T. Aichinger, G. Rescher
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引用次数: 8

摘要

研究了高温条件下高栅极电压脉冲作用下4H-SiC沟槽mosfet的偏置温度不稳定性(BTI)。这些脉冲对应于一个足够高的电场,以触发栅极氧化物中的撞击电离和相关效应。以阈值电压或VTh漂移形式测量的BTI效应在这些脉冲后比在充分低于冲击电离区的电压脉冲后的BTI更严重。本文所示的效应对应用于栅极的电场施加了上限,例如,在前端处理期间的器件筛选,以及在应用中。
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Influence of high-voltage gate-oxide pulses on the BTI behavior of SiC MOSFETs
We study the bias temperature instability (BTI) behavior of 4H-SiC trench MOSFETs after application of very high gate-voltage pulses at high temperatures. These pulses correspond to an electric field sufficiently high to trigger impact ionization and the associated effects in gate oxides. BTI effects measured in the form of threshold voltage or VTh drifts are more severe after these pulses as compared to BTI after voltage pulses that are sufficiently below the impact ionization regime. The effects shown in this paper impose an upper limit on electric fields applied to the gate during, e.g., device screening during front-end processing, but also in the application.
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