{"title":"计划回收测试晶圆的产量","authors":"Muh-Cherng Wu, C. Chien, K. Lu","doi":"10.1109/SMTW.2004.1393750","DOIUrl":null,"url":null,"abstract":"This paper formulates a decision problem and proposes two solution methods for selecting the yield improvement alternatives in the test wafer recycle processes. The decision problem is to determine the yield improvement target for each recycle process in order to minimize the use of test wafers","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Planning yields in recycling test wafers\",\"authors\":\"Muh-Cherng Wu, C. Chien, K. Lu\",\"doi\":\"10.1109/SMTW.2004.1393750\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper formulates a decision problem and proposes two solution methods for selecting the yield improvement alternatives in the test wafer recycle processes. The decision problem is to determine the yield improvement target for each recycle process in order to minimize the use of test wafers\",\"PeriodicalId\":369092,\"journal\":{\"name\":\"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)\",\"volume\":\"8 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-09-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMTW.2004.1393750\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMTW.2004.1393750","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper formulates a decision problem and proposes two solution methods for selecting the yield improvement alternatives in the test wafer recycle processes. The decision problem is to determine the yield improvement target for each recycle process in order to minimize the use of test wafers