{"title":"多区域化学机械抛光的多变量控制","authors":"Sheng-Jyh Shiul, Cheng-Ching Yu, S. Shen, A. Sul","doi":"10.1109/SMTW.2004.1393737","DOIUrl":null,"url":null,"abstract":"The modeling and multivariable control of the multi-zone CMP are studied in this work. In the process control notation, the manipulated variables are the three pressures applied to each zone. Therefore, this is a 60/spl times/3 non-square multivariable control problem. The singular value decomposition (SVD) is used to design a non-square feedback controller. The proposed control system is test on incoming wafers with different surface profiles. Results show that achievable performance can be maintained using the proposed SVD controller.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Multivariable control of multi-zone chemical mechanical polishing\",\"authors\":\"Sheng-Jyh Shiul, Cheng-Ching Yu, S. Shen, A. Sul\",\"doi\":\"10.1109/SMTW.2004.1393737\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The modeling and multivariable control of the multi-zone CMP are studied in this work. In the process control notation, the manipulated variables are the three pressures applied to each zone. Therefore, this is a 60/spl times/3 non-square multivariable control problem. The singular value decomposition (SVD) is used to design a non-square feedback controller. The proposed control system is test on incoming wafers with different surface profiles. Results show that achievable performance can be maintained using the proposed SVD controller.\",\"PeriodicalId\":369092,\"journal\":{\"name\":\"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)\",\"volume\":\"42 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-07-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMTW.2004.1393737\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMTW.2004.1393737","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Multivariable control of multi-zone chemical mechanical polishing
The modeling and multivariable control of the multi-zone CMP are studied in this work. In the process control notation, the manipulated variables are the three pressures applied to each zone. Therefore, this is a 60/spl times/3 non-square multivariable control problem. The singular value decomposition (SVD) is used to design a non-square feedback controller. The proposed control system is test on incoming wafers with different surface profiles. Results show that achievable performance can be maintained using the proposed SVD controller.
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