{"title":"用耦合场分析表征硅功率MOSFET逆变器的热电性能","authors":"Yanyan Liao, Y. Shen, H. Cheng, W. Chen","doi":"10.23919/ICEP.2019.8733567","DOIUrl":null,"url":null,"abstract":"In this paper, a coupled electric-thermal model is proposed to estimate the power loss and thermal performance of power module and three-phase inverter. First, the electrical extraction software is used to obtain parasitic parameters of the package. Then, the temperature field of the package is simulated under certain power by using computational fluid dynamics (CFD). Finally, the results of the electrical extraction and the CFD model are imported into the circuit simulation software to establish an equivalent circuit model for coupled calculation of conduction loss and switching loss under certain boundary condition. The results of the power loss and temperature field are also compared with the experimental data.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2019-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Characterization of Thermal-Electric Performance of Silicon Power MOSFET Inverter Using Coupled Field Analysis\",\"authors\":\"Yanyan Liao, Y. Shen, H. Cheng, W. Chen\",\"doi\":\"10.23919/ICEP.2019.8733567\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, a coupled electric-thermal model is proposed to estimate the power loss and thermal performance of power module and three-phase inverter. First, the electrical extraction software is used to obtain parasitic parameters of the package. Then, the temperature field of the package is simulated under certain power by using computational fluid dynamics (CFD). Finally, the results of the electrical extraction and the CFD model are imported into the circuit simulation software to establish an equivalent circuit model for coupled calculation of conduction loss and switching loss under certain boundary condition. The results of the power loss and temperature field are also compared with the experimental data.\",\"PeriodicalId\":213025,\"journal\":{\"name\":\"2019 International Conference on Electronics Packaging (ICEP)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP.2019.8733567\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP.2019.8733567","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Characterization of Thermal-Electric Performance of Silicon Power MOSFET Inverter Using Coupled Field Analysis
In this paper, a coupled electric-thermal model is proposed to estimate the power loss and thermal performance of power module and three-phase inverter. First, the electrical extraction software is used to obtain parasitic parameters of the package. Then, the temperature field of the package is simulated under certain power by using computational fluid dynamics (CFD). Finally, the results of the electrical extraction and the CFD model are imported into the circuit simulation software to establish an equivalent circuit model for coupled calculation of conduction loss and switching loss under certain boundary condition. The results of the power loss and temperature field are also compared with the experimental data.