碳掺杂功率AlGaN/GaN MOS-HEMTs中RON应力/恢复行为的陷阱动力学模型

N. Zagni, A. Chini, F. Puglisi, P. Pavan, M. Meneghini, G. Meneghesso, E. Zanoni, G. Verzellesi
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引用次数: 10

摘要

在本文中,我们给出了模拟结果,再现了碳掺杂功率GaN mos - hemt的应力和恢复实验,并解释了碳掺杂缓冲中空穴的发射、再分配和重新捕获导致的相关RON的增加和减少。所提出的模型可以直接阐明最近提出的p型漏接触对RON降解的有益影响,因为在应力作用下,缓冲层内的空穴捕获增强,负电荷捕获减少。
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Trap Dynamics Model Explaining the RON Stress/Recovery Behavior in Carbon-Doped Power AlGaN/GaN MOS-HEMTs
In this paper, we present simulation results that reproduce stress and recovery experiments in Carbon-doped power GaN MOS-HEMTs and explain the associated RON increase and decrease as the result of the emission, redistribution and re-trapping of holes within the Carbon-doped buffer. The proposed model can straightforwardly clarify the beneficial impact of the recently proposed p-type drain contact on RON degradation as being a consequence of enhanced hole trapping and reduced negative trapped charge within the buffer during stress.
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