Yu-Jin Li, W. Hsu, B. Lin, Chia-Cheng Chang, Chih Chen
{"title":"用于扇形圆片级封装的高韧性(111)纳米孪晶铜线","authors":"Yu-Jin Li, W. Hsu, B. Lin, Chia-Cheng Chang, Chih Chen","doi":"10.23919/ICEP.2019.8733599","DOIUrl":null,"url":null,"abstract":"In the present paper, the nt-Cu were electroplated on the InFO test vehicles with 5 μm line width to compare the reliability with the normal electroplated copper. The temperature of the TCT ranges from -55 to 125°C. The microstructure of the copper traces after 200 cycles and 1000 cycles was shown in the results. The nt-Cu RDL is much stronger than the normal Cu in the thermal cycling test. In order to understand the mechanical property of the nt-Cu and the normal Cu, tensile tests of electroplated copper foils was employed. After annealing at 250°C for 3 hours, the toughness of nt-Cu (about 60MJ/m3) is much higher than normal copper (about 30MJ/m3). In addition, the simulation results shows that the maximum stress on the copper trace during the TCT is about 200MPa which is much lower than the yield point of nt-Cu. In other word, the nt-Cu would return to original size when the stress removed without strain accumulation. In summary, we observed that the nt-Cu performs much better than normal copper in TCT. From the tensile test and simulation, we can understand the mechanical behavior and the typical reason for the high reliability of nt-Cu.","PeriodicalId":213025,"journal":{"name":"2019 International Conference on Electronics Packaging (ICEP)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2019-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"High-toughness (111) nano-twinned copper lines for fan-out wafer-level packaging\",\"authors\":\"Yu-Jin Li, W. Hsu, B. Lin, Chia-Cheng Chang, Chih Chen\",\"doi\":\"10.23919/ICEP.2019.8733599\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In the present paper, the nt-Cu were electroplated on the InFO test vehicles with 5 μm line width to compare the reliability with the normal electroplated copper. The temperature of the TCT ranges from -55 to 125°C. The microstructure of the copper traces after 200 cycles and 1000 cycles was shown in the results. The nt-Cu RDL is much stronger than the normal Cu in the thermal cycling test. In order to understand the mechanical property of the nt-Cu and the normal Cu, tensile tests of electroplated copper foils was employed. After annealing at 250°C for 3 hours, the toughness of nt-Cu (about 60MJ/m3) is much higher than normal copper (about 30MJ/m3). In addition, the simulation results shows that the maximum stress on the copper trace during the TCT is about 200MPa which is much lower than the yield point of nt-Cu. In other word, the nt-Cu would return to original size when the stress removed without strain accumulation. In summary, we observed that the nt-Cu performs much better than normal copper in TCT. From the tensile test and simulation, we can understand the mechanical behavior and the typical reason for the high reliability of nt-Cu.\",\"PeriodicalId\":213025,\"journal\":{\"name\":\"2019 International Conference on Electronics Packaging (ICEP)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-04-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP.2019.8733599\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP.2019.8733599","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
High-toughness (111) nano-twinned copper lines for fan-out wafer-level packaging
In the present paper, the nt-Cu were electroplated on the InFO test vehicles with 5 μm line width to compare the reliability with the normal electroplated copper. The temperature of the TCT ranges from -55 to 125°C. The microstructure of the copper traces after 200 cycles and 1000 cycles was shown in the results. The nt-Cu RDL is much stronger than the normal Cu in the thermal cycling test. In order to understand the mechanical property of the nt-Cu and the normal Cu, tensile tests of electroplated copper foils was employed. After annealing at 250°C for 3 hours, the toughness of nt-Cu (about 60MJ/m3) is much higher than normal copper (about 30MJ/m3). In addition, the simulation results shows that the maximum stress on the copper trace during the TCT is about 200MPa which is much lower than the yield point of nt-Cu. In other word, the nt-Cu would return to original size when the stress removed without strain accumulation. In summary, we observed that the nt-Cu performs much better than normal copper in TCT. From the tensile test and simulation, we can understand the mechanical behavior and the typical reason for the high reliability of nt-Cu.