用线法快速提取多层多导体互连的电容矩阵

Proceedings 1997 IEEE Multi-Chip Module Conference Pub Date : 1997-02-04 DOI:10.1109/MCMC.1997.569351

Xiao-hong Jiang, K. Wu, W. Hong, W. Dai

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引用次数: 1

摘要

本文采用线法(MoL)计算了嵌入在共形多层介质中的金属化厚度有限的多导体互连的二维和三维电容矩阵。结果与已发表的数据吻合较好。相比之下，该技术对具有任意形状拓扑结构的导体具有高效的计算和灵活的处理。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Fast extraction of the capacitance matrix of multilayered multiconductor interconnects using the method of lines

In this paper, the method of lines (MoL) is used to compute the 2-D and 3-D capacitance matrices of multiconductor interconnects with finite metalization thickness that are embedded in conformal multilayered dielectric media. Results show a good agreement with the published data. By contrast, this technique has efficient calculation and flexible handling of conductors having arbitrarily shaped topology.

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Proceedings 1997 IEEE Multi-Chip Module Conference

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