Two-Faced Bondable Leadframe Design: Maximizing Leadframe Usage and Purpose

As semiconductor industries continue to grow and the demand for quadflat pack no lead (QFN) packages dramatically increased, introduction of either technology enablers or derivatives are also expected to ramp up. This paper focused on derivative products that are packaged on a standard QFN structure. These types of derivative package require less to zero development activities that continue to contribute high volume manufacturing. With the drive to strengthen the core value of innovation, this presentation will discuss a proposed design of low cost leadframe that can save production cost and improve productivity. This is a two-faced bondable leadframe design under intellectual property (IP) application# 15/985,380. This two-faced bondable leadframe design where two sides - top and bottom of the leadframe can be used as bondable area primarily for wirebonding interconnects. With this cost effective material, multiple fabrication of leadframe can be reduced.