R. F. Carson, M. Warren, Preethi Dacha, Thomas E. Wilcox, J. Maynard, David J. Abell, Kirk J. Otis, J. Lott
{"title":"大功率高速VCSEL阵列的研究进展","authors":"R. F. Carson, M. Warren, Preethi Dacha, Thomas E. Wilcox, J. Maynard, David J. Abell, Kirk J. Otis, J. Lott","doi":"10.1117/12.2215009","DOIUrl":null,"url":null,"abstract":"Flip-chip bonding enables a unique architecture for two-dimensional arrays of VCSELs. Such arrays feature scalable power outputs and the capability to separately address sub-array regions while maintaining fast turn-on and turn-off response times. These substrate-emitting VCSEL arrays can also make use of integrated micro-lenses for beam shaping and directional control. Advances in the performance of these laser arrays will be reviewed and emerging applications are discussed.","PeriodicalId":122702,"journal":{"name":"SPIE OPTO","volume":"63 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-03-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":"{\"title\":\"Progress in high-power high-speed VCSEL arrays\",\"authors\":\"R. F. Carson, M. Warren, Preethi Dacha, Thomas E. Wilcox, J. Maynard, David J. Abell, Kirk J. Otis, J. Lott\",\"doi\":\"10.1117/12.2215009\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Flip-chip bonding enables a unique architecture for two-dimensional arrays of VCSELs. Such arrays feature scalable power outputs and the capability to separately address sub-array regions while maintaining fast turn-on and turn-off response times. These substrate-emitting VCSEL arrays can also make use of integrated micro-lenses for beam shaping and directional control. Advances in the performance of these laser arrays will be reviewed and emerging applications are discussed.\",\"PeriodicalId\":122702,\"journal\":{\"name\":\"SPIE OPTO\",\"volume\":\"63 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-03-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"16\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"SPIE OPTO\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1117/12.2215009\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"SPIE OPTO","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.2215009","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Flip-chip bonding enables a unique architecture for two-dimensional arrays of VCSELs. Such arrays feature scalable power outputs and the capability to separately address sub-array regions while maintaining fast turn-on and turn-off response times. These substrate-emitting VCSEL arrays can also make use of integrated micro-lenses for beam shaping and directional control. Advances in the performance of these laser arrays will be reviewed and emerging applications are discussed.
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