基于 MXene Ti3C2Tx 的侧向通道中的电导切换

Q4 Engineering Russian Microelectronics Pub Date : 2024-02-15 DOI:10.1134/s1063739723070260
N. V. Yakunina, N. P. Nekrasov, V. K. Nevolin, I. I. Bobrinetskiy
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引用次数: 0

摘要

摘要 目前,基于过渡金属碳化物或氮化物(MXenes)的夹层结构已在光学、电子学和光子学领域显示出其独特的性能。形成具有神经形态特性的元素是一个大有可为的趋势。本文研究了基于 Ti3C2Tx MXenes 的横向结构中的记忆效应。实验研究了如何根据外加电位差控制 MXene 沟道电导率中几种电流状态的形成。该结构是通过溶液沉积法在通道表面形成的金电极之间沉积出的 MXene Ti3C2Tx 薄膜,该薄膜位于氧化硅厚度为 200 nm 的硅衬底上。获得的样品使用原子力显微镜和拉曼光谱进行分析。结果表明,在这些结构中,根据外加电场的不同,有可能形成特定的电导率水平。观察到的导电率变化是两个数量级。基于 MXene 的结构中的导电性由通道中的陷阱态决定,并可持续 5 分钟以上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Conductivity Switching in Lateral Channels Based on MXene Ti3C2Tx

Abstract

At present, sandwich structures based on transition metal carbides or nitrides, MXenes, have demonstrated their unique properties in optics, electronics, and photonics. The formation of elements with neuromorphic properties is a promising trend. In this paper, the memristive effect in lateral structures based on Ti3C2Tx MXenes is considered. The control of the formation of several current states in the conductivity of a MXene channel depending on the applied potential difference is experimentally studied. The structure is a film of the MXene Ti3C2Tx composition deposited by solution deposition between the gold electrodes formed on the channel surface on a silicon substrate with silicon oxide 200 nm thick. The samples obtained are analyzed using atomic force microscopy and Raman spectroscopy. It is established that in these structures it is possible to form the given conductivity level, depending on the applied electric field. The observed change in the conductivity ratio is two orders of magnitude. Conductivity in structures based on MXene is determined by the trap states in the channel and persists for more than 5 min.

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来源期刊
Russian Microelectronics
Russian Microelectronics Materials Science-Materials Chemistry
CiteScore
0.70
自引率
0.00%
发文量
43
期刊介绍: Russian Microelectronics  covers physical, technological, and some VLSI and ULSI circuit-technical aspects of microelectronics and nanoelectronics; it informs the reader of new trends in submicron optical, x-ray, electron, and ion-beam lithography technology; dry processing techniques, etching, doping; and deposition and planarization technology. Significant space is devoted to problems arising in the application of proton, electron, and ion beams, plasma, etc. Consideration is given to new equipment, including cluster tools and control in situ and submicron CMOS, bipolar, and BICMOS technologies. The journal publishes papers addressing problems of molecular beam epitaxy and related processes; heterojunction devices and integrated circuits; the technology and devices of nanoelectronics; and the fabrication of nanometer scale devices, including new device structures, quantum-effect devices, and superconducting devices. The reader will find papers containing news of the diagnostics of surfaces and microelectronic structures, the modeling of technological processes and devices in micro- and nanoelectronics, including nanotransistors, and solid state qubits.
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