考虑封装特性的三维微机电镜面元件传热建模

Q4 Engineering Russian Microelectronics Pub Date : 2024-03-21 DOI:10.1134/s1063739723600292
S. S. Evstafyev, V. K. Samoylikov, D. V. Vertyanov
{"title":"考虑封装特性的三维微机电镜面元件传热建模","authors":"S. S. Evstafyev, V. K. Samoylikov, D. V. Vertyanov","doi":"10.1134/s1063739723600292","DOIUrl":null,"url":null,"abstract":"<h3 data-test=\"abstract-sub-heading\">\n<b>Abstract</b>—</h3><p>In a previous study, the authors demonstrated the steps necessary to determine the performance characteristics of a micromechanical mirror element. The mirror is made up of two bimorph structures consisting of aluminum and silicon dioxide, with a reflective element coated in aluminum attached to movable beams. By applying voltage to electrical heating elements within the beams, the structure can be manipulated due to uneven expansion of the materials. In this study, finite element analysis software is used to simulate the mirror and compare the results with analytical methods. The importance of accurate parameter calculation in designing micromechanical devices is emphasized. The study shows that the deflection sweep, overheating values, and heating/cooling times of the mirror beams align with previously calculated analytical expressions and experimental results. This suggests that the analytical method described in previous studies can be applied to designing micromechanical devices that rely on thermal principles and require precise temperature control for optimal performance. Also the package characteristics are considered and guidelines for it are given with consideration to mirror performance.</p>","PeriodicalId":21534,"journal":{"name":"Russian Microelectronics","volume":"26 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2024-03-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Modeling of Heat Transfer for a Three-Dimensional Microelectromechanical Mirror Element with Consideration of Its Packaging Features\",\"authors\":\"S. S. Evstafyev, V. K. Samoylikov, D. V. Vertyanov\",\"doi\":\"10.1134/s1063739723600292\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<h3 data-test=\\\"abstract-sub-heading\\\">\\n<b>Abstract</b>—</h3><p>In a previous study, the authors demonstrated the steps necessary to determine the performance characteristics of a micromechanical mirror element. The mirror is made up of two bimorph structures consisting of aluminum and silicon dioxide, with a reflective element coated in aluminum attached to movable beams. By applying voltage to electrical heating elements within the beams, the structure can be manipulated due to uneven expansion of the materials. In this study, finite element analysis software is used to simulate the mirror and compare the results with analytical methods. The importance of accurate parameter calculation in designing micromechanical devices is emphasized. The study shows that the deflection sweep, overheating values, and heating/cooling times of the mirror beams align with previously calculated analytical expressions and experimental results. This suggests that the analytical method described in previous studies can be applied to designing micromechanical devices that rely on thermal principles and require precise temperature control for optimal performance. Also the package characteristics are considered and guidelines for it are given with consideration to mirror performance.</p>\",\"PeriodicalId\":21534,\"journal\":{\"name\":\"Russian Microelectronics\",\"volume\":\"26 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2024-03-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Russian Microelectronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1134/s1063739723600292\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q4\",\"JCRName\":\"Engineering\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Russian Microelectronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1134/s1063739723600292","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"Engineering","Score":null,"Total":0}
引用次数: 0

摘要

摘要 在之前的一项研究中,作者展示了确定微机械镜元件性能特征的必要步骤。该镜面由铝和二氧化硅组成的两个双晶结构构成,铝涂层的反射元件附着在可移动的横梁上。通过向横梁内的电加热元件施加电压,可使结构因材料的不均匀膨胀而受到操纵。本研究使用有限元分析软件对镜子进行模拟,并将结果与分析方法进行比较。强调了在设计微型机械装置时精确计算参数的重要性。研究表明,镜梁的挠度扫描、过热值和加热/冷却时间与之前计算的分析表达式和实验结果一致。这表明,以前研究中描述的分析方法可用于设计依赖热原理并需要精确温度控制以获得最佳性能的微机械装置。此外,我们还考虑了封装特性,并在考虑到反射镜性能的情况下给出了封装指南。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Modeling of Heat Transfer for a Three-Dimensional Microelectromechanical Mirror Element with Consideration of Its Packaging Features

Abstract

In a previous study, the authors demonstrated the steps necessary to determine the performance characteristics of a micromechanical mirror element. The mirror is made up of two bimorph structures consisting of aluminum and silicon dioxide, with a reflective element coated in aluminum attached to movable beams. By applying voltage to electrical heating elements within the beams, the structure can be manipulated due to uneven expansion of the materials. In this study, finite element analysis software is used to simulate the mirror and compare the results with analytical methods. The importance of accurate parameter calculation in designing micromechanical devices is emphasized. The study shows that the deflection sweep, overheating values, and heating/cooling times of the mirror beams align with previously calculated analytical expressions and experimental results. This suggests that the analytical method described in previous studies can be applied to designing micromechanical devices that rely on thermal principles and require precise temperature control for optimal performance. Also the package characteristics are considered and guidelines for it are given with consideration to mirror performance.

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来源期刊
Russian Microelectronics
Russian Microelectronics Materials Science-Materials Chemistry
CiteScore
0.70
自引率
0.00%
发文量
43
期刊介绍: Russian Microelectronics  covers physical, technological, and some VLSI and ULSI circuit-technical aspects of microelectronics and nanoelectronics; it informs the reader of new trends in submicron optical, x-ray, electron, and ion-beam lithography technology; dry processing techniques, etching, doping; and deposition and planarization technology. Significant space is devoted to problems arising in the application of proton, electron, and ion beams, plasma, etc. Consideration is given to new equipment, including cluster tools and control in situ and submicron CMOS, bipolar, and BICMOS technologies. The journal publishes papers addressing problems of molecular beam epitaxy and related processes; heterojunction devices and integrated circuits; the technology and devices of nanoelectronics; and the fabrication of nanometer scale devices, including new device structures, quantum-effect devices, and superconducting devices. The reader will find papers containing news of the diagnostics of surfaces and microelectronic structures, the modeling of technological processes and devices in micro- and nanoelectronics, including nanotransistors, and solid state qubits.
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