用于分析较高击穿电压应用性能的 P SiC 芯壳 JLFET 分析模型

IF 2.7 Q2 PHYSICS, CONDENSED MATTER Micro and Nanostructures Pub Date : 2024-05-08 DOI:10.1016/j.micrna.2024.207868
Zahied Azam , Ashok Kumar
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引用次数: 0

摘要

在这篇文章中,我们提出了一种核壳(CS)结构,利用碳化硅(SiC)作为纳米线,在无结场效应晶体管(JLFET)中实现更高的击穿电压。P+ 芯壳改善了碳化硅 JLFET 的静电完整性,减少了横向带间隧道。此外,SiC 是宽带隙材料,有助于在如此短的沟道长度上实现 JLFET 的全体积耗尽。因此,即使在 600 K 温度和 VDS = 2.0 V 条件下,P+ SiC CS JLFET 的关态电流也能降低到 10-16 μA。即使在更高的漏极电压下,P+ SiC CS JLFET 也能显示出显著的性能。因此,我们研究了 P+ SiC CS JLFET 在更高击穿电压和更高温度下的性能。此外,我们还研究了较高漏极电压对较高温度的影响。本文提出了 P+ SiC CS JLFET 的分析模型,该模型考虑了纳米线的泊松方程以及阈值电压 (Vth) 时的表面电势和零点电场 (Ez)。该模型表明,纳米线的表面电势和电场对于准确估算漏极电流至关重要。除了 SILVACO TCAD 提供的数值建模结果外,还将提出的分析模型的性能与模拟结果进行了比较。结果表明,仿真结果与所提出的紧凑型模型之间具有良好的一致性。这表明所提出的模型可用于准确预测纳米级晶体管的漏极电流。
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An analytical model of P+ SiC core-shell JLFETs to analyze the performance for higher breakdown voltages applications

In this article, we proposed a core-shell (CS) architecture that uses the silicon carbide (SiC) as a nanowire for higher breakdown voltages in a Junctionless field effect transistor (JLFET). The P+ core-shell improves the electrostatic integrity and reduces lateral band-to-band tunneling in SiC JLFET. Furthermore, the SiC is wide band gap material which helps to achieve the full volume depletion in JLFET at such short channel lengths. Thus, the OFF-state current in P+ SiC CS JLFET has reduced to 10−16 μA even at temperature 600 K and VDS = 2.0 V. The P+ SiC CS JLFET shows significant performance even at higher drain voltages. Hence, we investigate the P+ SiC CS JLFET for higher breakdown voltages with the impact of higher temperatures. In addition, the impact of higher drain voltages with higher temperatures is also examined. This paper presents an analytical model for P+ SiC CS JLFETs which considers Poisson's equation for nanowires as well as the surface potential at the threshold voltage (Vth) and electric field at the zero point (Ez). The model shows that the surface potential and the electric fields in nanowires are essential for an accurate estimation of the drain current. In addition to the numerical modeling results provided by SILVACO TCAD, the performance of the proposed analytical model was compared with simulation results. The results showed good agreement between the simulations and the proposed compact model. This indicates that the proposed model can be used to provide accurate drain current predictions in nanoscale transistors.

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