编辑 "2022 年国际半导体工艺和设备模拟会议论文选"

IF 1.4 4区 物理与天体物理 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Solid-state Electronics Pub Date : 2024-06-12 DOI:10.1016/j.sse.2024.108973
Francisco Gamiz, Carlos Sampedro, Luca Donetti, Carlos Navarro
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Editorial “Selected papers from the international conference on simulation of semiconductor processes and devices 2022”
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来源期刊
Solid-state Electronics
Solid-state Electronics 物理-工程:电子与电气
CiteScore
3.00
自引率
5.90%
发文量
212
审稿时长
3 months
期刊介绍: It is the aim of this journal to bring together in one publication outstanding papers reporting new and original work in the following areas: (1) applications of solid-state physics and technology to electronics and optoelectronics, including theory and device design; (2) optical, electrical, morphological characterization techniques and parameter extraction of devices; (3) fabrication of semiconductor devices, and also device-related materials growth, measurement and evaluation; (4) the physics and modeling of submicron and nanoscale microelectronic and optoelectronic devices, including processing, measurement, and performance evaluation; (5) applications of numerical methods to the modeling and simulation of solid-state devices and processes; and (6) nanoscale electronic and optoelectronic devices, photovoltaics, sensors, and MEMS based on semiconductor and alternative electronic materials; (7) synthesis and electrooptical properties of materials for novel devices.
期刊最新文献
Temperature influence on experimental analog behavior of MISHEMTs A novel method used to prepare PN junction by plasmon generated under pulsed laser irradiation on silicon chip Achieving 15.75% efficiency in solar cells: Advanced surface engineering using Tetra-Tert-Butyl-Tercarbazol-Benzonitrile and organic layer integration in n-type silicon wafer and hybrid Planar-Si systems Influence of Ag-Bi2S3 nanocomposites for highly sensitive and selective Cl2 gas sensors: Synthesis, characterization, and gas sensing performance Editorial Board
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