带有叠层 SiO2/HfO2 亚门电介质的硅场效应锥形 GAA 纳米晶体管仿真

Q4 Engineering Russian Microelectronics Pub Date : 2024-07-26 DOI:10.1134/s1063739724600274
N. V. Masal’skii
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引用次数: 0

摘要

摘要 讨论了硅锥形场效应栅全围(GAA)纳米晶体管电气特性的建模问题。考虑到硅/二氧化硅界面上的界面陷阱电荷的影响,建立了一个具有完全包覆锥形栅极和堆叠子栅极 SiO2/HfO2 氧化物的晶体管漏极电流的分析模型。为了模拟陷阱密度恒定条件下锥形工作区的电势分布,在圆柱坐标系中使用抛物线近似法得到了泊松方程的解析解,并给出了相应的边界条件。利用该势垒模型,我们得出了具有叠层亚门氧化物的 GAA 纳米晶体管漏极电流的表达式。根据阱的密度以及二氧化硅层和二氧化铪层的厚度,对关键的电气和物理特性进行了数值研究。
本文章由计算机程序翻译,如有差异,请以英文原文为准。

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Simulation of Silicon Field-Effect Conical GAA Nanotransistors with a Stacked SiO2/HfO2 Subgate Dielectric

Abstract

The issues of modeling the electrical characteristics of a silicon conical field-effect gate-all-around (GAA) nanotransistor are discussed. An analytical model of the drain current of a transistor with a fully encompassing conical gate with a stacked subgate SiO2/HfO2 oxide, taking into account the influence of the charge of the interfacial trap at the Si/SiO2 interface, is developed. To model the potential distribution in a conical working area under the condition of a constant trap density, an analytical solution of the Poisson equation is obtained using the parabolic approximation method in the cylindrical coordinate system with the corresponding boundary conditions. The potential model is used to develop an expression for the drain current of a GAA nanotransistor with a stacked subgate oxide. The key electrical and physical characteristics are numerically studied depending on the density of the traps and the thickness of the SiO2 and HfO2 layers.

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来源期刊
Russian Microelectronics
Russian Microelectronics Materials Science-Materials Chemistry
CiteScore
0.70
自引率
0.00%
发文量
43
期刊介绍: Russian Microelectronics  covers physical, technological, and some VLSI and ULSI circuit-technical aspects of microelectronics and nanoelectronics; it informs the reader of new trends in submicron optical, x-ray, electron, and ion-beam lithography technology; dry processing techniques, etching, doping; and deposition and planarization technology. Significant space is devoted to problems arising in the application of proton, electron, and ion beams, plasma, etc. Consideration is given to new equipment, including cluster tools and control in situ and submicron CMOS, bipolar, and BICMOS technologies. The journal publishes papers addressing problems of molecular beam epitaxy and related processes; heterojunction devices and integrated circuits; the technology and devices of nanoelectronics; and the fabrication of nanometer scale devices, including new device structures, quantum-effect devices, and superconducting devices. The reader will find papers containing news of the diagnostics of surfaces and microelectronic structures, the modeling of technological processes and devices in micro- and nanoelectronics, including nanotransistors, and solid state qubits.
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