{"title":"具有高阈值电压和更佳动态性能的鳍式栅 p-GaN HEMT","authors":"Lingyan Shen , Xuetong Zhou , Li Zheng , Xinhong Cheng","doi":"10.1016/j.mejo.2024.106442","DOIUrl":null,"url":null,"abstract":"<div><div>A novel fin-gate p-GaN (FPG) HEMT is proposed to simultaneously increase threshold voltage (V<sub>th</sub>) and improve dynamic performance of the p-GaN HEMT. The fin-gate structure works as a normally-on p-channel MESFET between gate and source by forming a Schottky-type contact on sidewall and a source-connected Ohmic-type contact on top of the fin. Thus, the V<sub>th</sub> can change with the shutdown voltage of the p-channel MESFET, which can be modulated by the doping concentration and width of the fin-p-GaN. By optimizing the fin structure, a high positive V<sub>th</sub> of 4V is achieved without transconductance and breakdown voltage degradation in this work. It breaks the restriction between V<sub>th</sub> and on-resistance for conventional p-GaN HEMT. The dynamic characteristics of the FPG HEMT are investigated by SPICE simulations. Owing to the well-grounded p-GaN through the normally-on MESFET, the recovery process of the dynamic shift in V<sub>th</sub> (ΔV<sub>th</sub>) after on/off-state stress can be accelerated by two orders of magnitude. It means an imperceptible dynamic degradation and a great potential in high frequency application for the FPG HEMT.</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":null,"pages":null},"PeriodicalIF":1.9000,"publicationDate":"2024-10-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A fin-gate p-GaN HEMT with high threshold voltage and improved dynamic performance\",\"authors\":\"Lingyan Shen , Xuetong Zhou , Li Zheng , Xinhong Cheng\",\"doi\":\"10.1016/j.mejo.2024.106442\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><div>A novel fin-gate p-GaN (FPG) HEMT is proposed to simultaneously increase threshold voltage (V<sub>th</sub>) and improve dynamic performance of the p-GaN HEMT. The fin-gate structure works as a normally-on p-channel MESFET between gate and source by forming a Schottky-type contact on sidewall and a source-connected Ohmic-type contact on top of the fin. Thus, the V<sub>th</sub> can change with the shutdown voltage of the p-channel MESFET, which can be modulated by the doping concentration and width of the fin-p-GaN. By optimizing the fin structure, a high positive V<sub>th</sub> of 4V is achieved without transconductance and breakdown voltage degradation in this work. It breaks the restriction between V<sub>th</sub> and on-resistance for conventional p-GaN HEMT. The dynamic characteristics of the FPG HEMT are investigated by SPICE simulations. Owing to the well-grounded p-GaN through the normally-on MESFET, the recovery process of the dynamic shift in V<sub>th</sub> (ΔV<sub>th</sub>) after on/off-state stress can be accelerated by two orders of magnitude. It means an imperceptible dynamic degradation and a great potential in high frequency application for the FPG HEMT.</div></div>\",\"PeriodicalId\":49818,\"journal\":{\"name\":\"Microelectronics Journal\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":1.9000,\"publicationDate\":\"2024-10-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Microelectronics Journal\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/S1879239124001462\",\"RegionNum\":3,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Journal","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1879239124001462","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
A fin-gate p-GaN HEMT with high threshold voltage and improved dynamic performance
A novel fin-gate p-GaN (FPG) HEMT is proposed to simultaneously increase threshold voltage (Vth) and improve dynamic performance of the p-GaN HEMT. The fin-gate structure works as a normally-on p-channel MESFET between gate and source by forming a Schottky-type contact on sidewall and a source-connected Ohmic-type contact on top of the fin. Thus, the Vth can change with the shutdown voltage of the p-channel MESFET, which can be modulated by the doping concentration and width of the fin-p-GaN. By optimizing the fin structure, a high positive Vth of 4V is achieved without transconductance and breakdown voltage degradation in this work. It breaks the restriction between Vth and on-resistance for conventional p-GaN HEMT. The dynamic characteristics of the FPG HEMT are investigated by SPICE simulations. Owing to the well-grounded p-GaN through the normally-on MESFET, the recovery process of the dynamic shift in Vth (ΔVth) after on/off-state stress can be accelerated by two orders of magnitude. It means an imperceptible dynamic degradation and a great potential in high frequency application for the FPG HEMT.
期刊介绍:
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.