Yifei Li , Pengxiang Hou , Shuangyuan Pan , Pin Wang , Weiwei Cheng , Jing Wang , Le Yu , Zheyang Li , Rui Jin
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Dislocations in 4H-SiC epilayers for power devices: Identification, formation, and regulation
4H-SiC is highly promising for modern electronics, particularly in high-temperature, high-frequency, and high-power applications. However, the presence of dislocations in 4H-SiC epilayers significantly affects the performance and reliability of 4H-SiC-based power devices, thus limiting their widespread application. This review provides an overview of the classification, fundamental properties, and inspection methods of dislocations in 4H-SiC epilayers. The mechanisms of dislocation nucleation, propagation, and conversion during epitaxial growth are presented. Furthermore, strategies to mitigate dislocations, with a particular focus on enhancing the efficiency of BPD-TED conversion, are comprehensively discussed. By offering insights into dislocation behavior in 4H-SiC epilayers, this review highlights the challenges and emerging directions in the study of dislocations.
期刊介绍:
Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy.
Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications.
Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.