TiO2/Cu/TiO2多层膜的透光率及电磁屏蔽性能研究

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2025-01-09 DOI:10.1007/s10854-024-14199-4
Linlin Lu, Zhenghua Yang, Jie Xu, Jie Dong
{"title":"TiO2/Cu/TiO2多层膜的透光率及电磁屏蔽性能研究","authors":"Linlin Lu,&nbsp;Zhenghua Yang,&nbsp;Jie Xu,&nbsp;Jie Dong","doi":"10.1007/s10854-024-14199-4","DOIUrl":null,"url":null,"abstract":"<div><p>TiO<sub>2</sub>/Cu/TiO<sub>2</sub> multilayer films were prepared on quartz glass by magnetron sputtering, and the effects of Cu film thickness on the electrical, optical and electromagnetic shielding performance of TiO<sub>2</sub>/Cu/TiO<sub>2</sub> multilayer films were investigated. The results show that with the increase of Cu film thickness from 14 to 34 nm, the square resistance of TiO<sub>2</sub>/Cu/TiO<sub>2</sub> multilayer films gradually decreases from 13.1 to 3.29 Ω, and the average visible light transmittance of the multilayer films drops from 80.2% to 66.0%. With the increase of Cu film thicknesses, electromagnetic shielding performance of TiO<sub>2</sub>/Cu/TiO<sub>2</sub> multilayer films exhibits an upward trend. The total electromagnetic shielding effectiveness (<i>SE</i><sub><i>T</i></sub>) of TiO<sub>2</sub>/Cu/TiO<sub>2</sub> multilayer film (30/34/30 nm thick) reaches the maximum, and the <i>SE</i><sub><i>T</i></sub> value of the multilayer film exceeds 19 dB.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"36 2","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2025-01-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Research on optical transmittance and electromagnetic shielding effectiveness of TiO2/Cu/TiO2 multilayer film\",\"authors\":\"Linlin Lu,&nbsp;Zhenghua Yang,&nbsp;Jie Xu,&nbsp;Jie Dong\",\"doi\":\"10.1007/s10854-024-14199-4\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>TiO<sub>2</sub>/Cu/TiO<sub>2</sub> multilayer films were prepared on quartz glass by magnetron sputtering, and the effects of Cu film thickness on the electrical, optical and electromagnetic shielding performance of TiO<sub>2</sub>/Cu/TiO<sub>2</sub> multilayer films were investigated. The results show that with the increase of Cu film thickness from 14 to 34 nm, the square resistance of TiO<sub>2</sub>/Cu/TiO<sub>2</sub> multilayer films gradually decreases from 13.1 to 3.29 Ω, and the average visible light transmittance of the multilayer films drops from 80.2% to 66.0%. With the increase of Cu film thicknesses, electromagnetic shielding performance of TiO<sub>2</sub>/Cu/TiO<sub>2</sub> multilayer films exhibits an upward trend. The total electromagnetic shielding effectiveness (<i>SE</i><sub><i>T</i></sub>) of TiO<sub>2</sub>/Cu/TiO<sub>2</sub> multilayer film (30/34/30 nm thick) reaches the maximum, and the <i>SE</i><sub><i>T</i></sub> value of the multilayer film exceeds 19 dB.</p></div>\",\"PeriodicalId\":646,\"journal\":{\"name\":\"Journal of Materials Science: Materials in Electronics\",\"volume\":\"36 2\",\"pages\":\"\"},\"PeriodicalIF\":2.8000,\"publicationDate\":\"2025-01-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of Materials Science: Materials in Electronics\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://link.springer.com/article/10.1007/s10854-024-14199-4\",\"RegionNum\":4,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-024-14199-4","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0

摘要

采用磁控溅射的方法在石英玻璃上制备了TiO2/Cu/TiO2多层膜,研究了Cu膜厚度对TiO2/Cu/TiO2多层膜的电、光学和电磁屏蔽性能的影响。结果表明:随着Cu膜厚度从14 nm增加到34 nm, TiO2/Cu/TiO2多层膜的平方电阻从13.1逐渐减小到3.29 Ω,多层膜的平均可见光透过率从80.2%下降到66.0%。随着Cu膜厚度的增加,TiO2/Cu/TiO2多层膜的电磁屏蔽性能呈上升趋势。TiO2/Cu/TiO2多层膜(30/34/30 nm厚)的总电磁屏蔽效能(SET)达到最大值,其SET值超过19 dB。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Research on optical transmittance and electromagnetic shielding effectiveness of TiO2/Cu/TiO2 multilayer film

TiO2/Cu/TiO2 multilayer films were prepared on quartz glass by magnetron sputtering, and the effects of Cu film thickness on the electrical, optical and electromagnetic shielding performance of TiO2/Cu/TiO2 multilayer films were investigated. The results show that with the increase of Cu film thickness from 14 to 34 nm, the square resistance of TiO2/Cu/TiO2 multilayer films gradually decreases from 13.1 to 3.29 Ω, and the average visible light transmittance of the multilayer films drops from 80.2% to 66.0%. With the increase of Cu film thicknesses, electromagnetic shielding performance of TiO2/Cu/TiO2 multilayer films exhibits an upward trend. The total electromagnetic shielding effectiveness (SET) of TiO2/Cu/TiO2 multilayer film (30/34/30 nm thick) reaches the maximum, and the SET value of the multilayer film exceeds 19 dB.

求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
期刊最新文献
Phase regulated design strategy of antiferroelectric Cd-modified (Pb, La) (Sn, Zr, Ti) O3 ceramics for pulsed power capacitors Random vibration lifetime prediction model based on overshoot correction for metal hermetic sealing structure considering transient response Additively manufactured polyethylene terephthalate-based high-gain multiband-flexible antenna for wireless mobile applications Fabricating In2O3 NPs /MWCNTs heterostructure photodetectors by laser ablation method Rational design of CoNiMo trimetallic hydroxide nanostructured flexible electrode for supercapacitor application
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1