用于人体运动监测的环保可回收热固性聚氨酯复合材料

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2025-01-17 DOI:10.1007/s10854-024-14189-6
Yufang Liao, Yuqi Li, Hong Ruan
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引用次数: 0

摘要

设计和开发环境友好、可回收的摩擦层材料是制备摩擦电纳米发电机的关键。本文介绍了一种可回收的摩擦层材料CFPU-X。这种材料通过含有马来酰亚胺基团的聚氨酯(MPU)和含有呋喃基团的羧化纤维素纳米晶体之间的Diels-Alder反应动态交联。该反应增强了聚氨酯的交联度,显著提高了聚氨酯的抗拉强度,其中CFPU-15的抗拉强度最大值为18.18 MPa,比MPU提高了761.61%。值得注意的是,CFPU-9表现出自增韧性能,这可能是由于加热和再溶解后分子链在同一空间内生长。这导致了氢键含量的增加和更紧凑的重新配置的交联网络,导致断裂伸长率提高了145.83%。CFPU-12 TENG有望用于医疗诊断、运动分析和健康监测。这项研究为高性能、柔性能量采集器的可回收材料的开发提供了有价值的思路。
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Eco-friendly and recyclable thermosetting polyurethane composites for human motion monitoring

Designing and developing friction layer materials that are environmentally friendly and recyclable is key to preparing triboelectric nanogenerators (TENG). Herein, a recyclable friction layer material, CFPU-X, has been introduced. This material is dynamically crosslinked through a Diels-Alder reaction between a polyurethane (MPU) containing maleimide groups and carboxylated cellulose nanocrystals with furan groups. The reaction enhanced the cross-linking degree of polyurethane, resulting in a significant increase in tensile strength, with CFPU-15 exhibiting a maximum value of 18.18 MPa, a 761.61% improvement over MPU. Notably, CFPU-9 demonstrated self-toughening properties, possibly attributed to the growth of molecular chains in the same space after heating and redissolution. This resulted in an increase in hydrogen bonding content and a more compact reconfigured crosslinked network, leading to a 145.83% increase in elongation at break. The CFPU-12 TENG is expected to be utilized in medical diagnostics, motion analysis, and health monitoring. This study offers worthy ideas for the development of recyclable materials for high-performance, flexible energy harvesters.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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