一步法直接煅烧板栗皮膜的超薄高效微波吸收研究

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2025-01-17 DOI:10.1007/s10854-024-14204-w
Yangyang Liu, Jiaojiao Yuan, Aming Xie, Jing He
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引用次数: 0

摘要

目前,生物质基吸收材料因其重量轻、成本低、绿色环保、易获取等优点而受到广泛关注。然而,通常会采用额外的激活方法,这大大提高了成本。为了克服这一缺点,我们利用板栗内皮的一种常见的生物废弃物,即板栗糖化工业中经常直接丢弃的板栗皮作为原料,通过一步快速热解合成了一种非常低成本的生物质基吸收剂(CMs),无需进一步活化或改性。结果表明,只要选择合适的活化温度,这些材料就能表现出优异的微波吸收性能。经700℃煅烧后,CM-700具有较强的微波吸收性能,最大反射损耗为- 56.73 dB。CM-800在超薄厚度仅为1.6 mm的情况下,有效微波吸收带宽达到5.09 GHz (12.91 ~ 18.00 Hz)。提出了一种合理的膜基材料能量耗散机制。
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Efficient microwave absorption with ultra-thin thickness through one-step direct calcination of pellicle of Castanea mollissima Blume

Currently, biomass-based absorbers have drawn much attention as microwave absorption materials due to their intrinsic low-weight, low cost, green, and easy availability. However, additional activation methodologies are often employed, significantly elevating cost. In order to overcome this drawback, we use a common biowaste of the inner skin of Chinese chestnut, i.e., the pellicle, often directly discarded in the candied chestnut industry, as the raw material to synthesize a very low-cost biomass-based absorbers (CMs) through one-step facile pyrolysis without further activation or modification. The results show that these materials can exhibit excellent microwave absorption capabilities if the activation temperature is carefully chosen. Calcinated at 700 °C, CM-700 shows strong microwave absorption performance, and the maximum reflection loss is as strong as − 56.73 dB. Moreover, the effective microwave absorption bandwidth of CM-800 reaches 5.09 GHz (ranging from 12.91 to 18.00 Hz) under the ultra-thin thickness of just 1.6 mm. A plausible energy-dissipation mechanism of the pellicle-based materials is proposed.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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