纳米结构钴基Co-Fe-Zr-Nb-B合金的固溶特性及磁性演化

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2025-01-18 DOI:10.1007/s10854-025-14209-z
M. Pirpour, S. A. Hashemizadeh, H. Raanaei
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引用次数: 0

摘要

研究了球磨法制备的Co49Fe21Zr10Nb5B15合金粉末的磁性、显微组织和热行为。利用x射线衍射、扫描电镜、能量色散x射线能谱、高分辨率透射电镜、差示扫描量热法和振动样品磁强计对样品进行了表征。结果表明:磨矿40 h后,开始形成铁基固溶相,180 h后形成部分固溶体,最终晶粒平均尺寸达到23 nm,平均粒径约为3.4 μm;最终样品的饱和磁化强度与之前的报道相比相对较高。在铣削时间为40 ~ 180 h时,矫顽力值呈连续增加趋势。合金样品的热分析显示出三个放热峰,为合金的相变提供了见解。研究结果表明,软铁磁行为,特别是对于退火样品。
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Solid solution characteristic and magnetic evolutions of nanostructured cobalt-based Co–Fe–Zr–Nb–B alloy

This research investigated the magnetic, microstructure, and thermal behavior of Co49Fe21Zr10Nb5B15 alloyed powder prepared by ball milling method. The milled samples were characterized using X-ray diffraction, scanning electron microscopy, energy dispersive X-ray spectroscopy, high-resolution transmission electron microscopy, differential scanning calorimetry, and vibrating sample magnetometry. The results demonstrated that after 40 h of milling, an iron-based solid solution phase began to form, ultimately leading to a partially solid solution with undissolved zirconium and cobalt after 180 h. The final average crystallite size reached 23 nm with a mean particle size of about 3.4 μm. The saturation magnetization of the final sample was relatively high compared to previous reports. Coercivity values showed a continuous increase from 40 to 180 h of milling time. The thermal analysis of the alloy sample exhibited three exothermic peaks, providing insights into the phase transformations of the alloy. The findings indicated soft ferromagnetic behavior, particularly for the annealed samples.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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