不同单体混合物及光引发剂体系的牙科胶黏剂与氧化锆的物理化学性质及结合强度

Constantino Fernandes Neto, M. Narimatsu, P. Magão, Reginaldo Mendonça da Costa, C. Pfeifer, A. Furuse
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引用次数: 1

摘要

摘要简介:结合到结晶氧化锆是目前的一个挑战。适当固化的粘合剂对于优化这种结合至关重要,而这反过来又受到系统的初始迁移率以及引发剂的反应性的影响。目的:本研究旨在表征含有不同粘度单体混合物和双、三元光引发剂体系的胶粘剂;并评估当粘合剂用单波或多波光固化单元(LCU)光活化时与Y-TZP氧化锆的结合。材料和方法:粘合剂按Bis-GMA/TEGDMA或Bis-GMA/Bis EMA的1:1重量比例配制。对于这些混合物0.5 CQ的wt%,0.5–1.0 DABE的wt%,0.5–1.0 DPIHP的wt%,或0.5–1.0 加入wt%的TAS-Sb并用作光引发剂体系。总共制备了十种粘合剂。将树脂复合圆柱体粘结在氧化锆片上,并进行了6000次热循环。7之后的转化度(DC)、吸附度(SO)和溶解度(SL) 水储存天数和微剪切结合强度(µSBS)。数据采用三元方差分析和Tukey的HSD(α = 结果:Bis-GMA/Bis-EMA联合CQ/DABE或CQ/DABE/TAS-Sb的DC最高,LCU无显著差异(p = .298)。CQ/DABE < CQ/DABE/TAS Sb≈CQ/DABE/DPIHP,多波LCU显示较小的总SO(p < .05)。用多波LCU固化的具有CQ/DABE的双GMA/TEGDMA呈现最低的SO。SL变化如下:CQ/DABE/TAS-Sb < CQ/DABE/DPIHP < CQ/DABE(p < .001)。对于µSBS,只有因子光引发剂体系是显著的(p = .045)。所有平均值均在30以上 对于BIS-GMA/TEGDMA和CQ/DABE观察到更高的值。结论:以CQ/DABE/TAS-Sb为双GMA/Bis-EMA混合物共引发剂的胶粘剂可制备出具有较高DC和较低SL的材料,而粘结强度值与CQ/DABE相近。
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Physical-chemical characterization and bond strength to zirconia of dental adhesives with different monomer mixtures and photoinitiator systems light-activated with poly and monowave devices
Abstract Introduction: Bonding to crystalline zirconia is currently a challenge. Properly cured adhesives are crucial to optimize this bond, and that in turn is influenced by the initial mobility of the system, as well as by the reactivity of the initiators. Aim: This study aimed to characterize adhesives containing monomer mixtures of different viscosities and double and triple photoinitiator systems; and to evaluate the bonding to Y-TZP zirconia, when adhesives were light-activated with monowave or polywave light-curing units (LCU). Materials and methods: Adhesives were formulated at a 1:1 weight proportion of Bis-GMA/TEGDMA or Bis-GMA/Bis-EMA. To these mixtures 0.5 wt% of CQ, 0.5–1.0 wt% of DABE, 0.5–1.0 wt% of DPIHP, or 0.5–1.0 wt% of TAS-Sb were added and used as photoinitiator systems. A total of ten adhesives were prepared. Resin composite cylinders were cemented on zirconia slices and 6000 thermal cycles were performed. Degree of conversion (DC), sorption (SO) and solubility (SL) after 7 days of water storage, and microshear bond strength (µSBS) were evaluated. Data were analyzed with three-way ANOVA and Tukey’s HSD (α = 0.05). Results: Bis-GMA/Bis-EMA combined with either CQ/DABE or CQ/DABE/TAS-Sb presented the highest DC, and no significant differences were observed for LCUs (p = .298). CQ/DABE < CQ/DABE/TAS-Sb ≈ CQ/DABE/DPIHP and the polywave LCU showed smaller overall SO (p < .05). Bis-GMA/TEGDMA with CQ/DABE cured with the polywave LCU presented the lowest SO. SL varied as follows: CQ/DABE/TAS-Sb < CQ/DABE/DPIHP < CQ/DABE (p < .001). For µSBS, only the factor photoinitiator system was significant (p = .045). All mean values were above 30 MPa, with higher values being observed for BIS-GMA/TEGDMA and CQ/DABE. Conclusion: It can be concluded that the adhesive containing CQ/DABE/TAS-Sb as coinitiator of Bis-GMA/Bis-EMA mixtures produced a material with higher DC and lower SL, while bond strength values were similar to the ones obtained by CQ/DABE.
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