不同原料制备多孔Cu-Al-Ni形状记忆合金的制备及其阻尼性能

Huan-Yeuh Chu, G. Hao, Puguang Ji, Jianjun Zhang, Tianyuan Zheng, Qingzhou Wang
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引用次数: 0

摘要

以Cu、Al、Ni粉末和Cu - Al - Ni合金粉末为原料,采用粉末冶金法制备了多孔Cu - Al - Ni形状记忆合金。结果发现,两种试样具有相似的宏观形貌:连通孔隙均匀分布在Cu-Al-Ni基体中,形成三维网状结构。通过比较,合金粉末制备的试样比Cu、Al、Ni粉末制备的试样具有更精细的显微组织。在Cu-Al-Ni基体中加入Ce元素后,Cu-Al-Ni基体的微观结构明显细化,形成了富Ce颗粒。阻尼试验表明,后者的阻尼能力优于前者。随着Ce含量的增加,后者的阻尼先增大后减小。当Ce含量达到0.05 wt%时,阻尼达到最大。根据微观结构观察,讨论了相关机理。
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Fabrication and Damping Property of Porous Cu–Al–Ni Shape Memory Alloys Fabricated using Different Raw Materials
Porous Cu–Al–Ni shape memory alloys (SMAs) are fabricated via powder metallurgy method using Cu, Al, Ni powders and Cu–Al–Ni alloy powder as raw materials, respectively. It is found that the two kinds of specimens have similar macroscopic morphologies: connected pores are uniformly distributed in the Cu–Al–Ni matrix, forming a 3D network structure. By comparison, the specimen fabricated using alloy powder has much finer microstructures than the specimens fabricated using Cu, Al, Ni powders. After adding Ce element to the latter, the microstructure of the Cu–Al–Ni matrix is significantly refined because of the formation of Ce‐rich particles. Damping tests show that the latter has superior damping capacity than the former. With the increase of Ce content, the damping of the latter increases first and then decreases. When the Ce content reaches 0.05 wt%, the highest damping can be achieved. Correlated mechanisms are discussed based on the microstructural observations.
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