{"title":"焊料疲劳-蠕变相互作用损伤模型研究","authors":"Na Liu, Xiaoyan Li, Yongchang Yan","doi":"10.1109/ICEPT.2008.4607157","DOIUrl":null,"url":null,"abstract":"It is well known, reliability and workability are the more important issues in the field of chip size package (CSP). Creep and fatigue behaviors are the main loads of the solder joints, the reliability of which should take account of those two main loads. Based on the theory of continuum damage mechanics (CDM), this paper focuses on damage evolution of interaction between the fatigue and creep. A new damage model of fatigue-creep interaction has been developed. And the new fatigue-creep interaction damage model in this paper does not require the simple fatigue model and simple creep model.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":"35 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Investigation on fatigue-creep interaction damage model for solder\",\"authors\":\"Na Liu, Xiaoyan Li, Yongchang Yan\",\"doi\":\"10.1109/ICEPT.2008.4607157\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"It is well known, reliability and workability are the more important issues in the field of chip size package (CSP). Creep and fatigue behaviors are the main loads of the solder joints, the reliability of which should take account of those two main loads. Based on the theory of continuum damage mechanics (CDM), this paper focuses on damage evolution of interaction between the fatigue and creep. A new damage model of fatigue-creep interaction has been developed. And the new fatigue-creep interaction damage model in this paper does not require the simple fatigue model and simple creep model.\",\"PeriodicalId\":6324,\"journal\":{\"name\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"volume\":\"35 1\",\"pages\":\"1-3\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-07-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2008.4607157\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2008.4607157","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Investigation on fatigue-creep interaction damage model for solder
It is well known, reliability and workability are the more important issues in the field of chip size package (CSP). Creep and fatigue behaviors are the main loads of the solder joints, the reliability of which should take account of those two main loads. Based on the theory of continuum damage mechanics (CDM), this paper focuses on damage evolution of interaction between the fatigue and creep. A new damage model of fatigue-creep interaction has been developed. And the new fatigue-creep interaction damage model in this paper does not require the simple fatigue model and simple creep model.
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