从低功率到高功率电子产品的创新技术

2018 IEEE Symposium on VLSI Technology Pub Date : 2018-06-01 DOI:10.1109/VLSIT.2018.8510677

P. Coudrain, J. Colonna, L. Collin, R. Prieto, L. Fréchette, J. Barrau, G. Savelli, P. Vivet, Q. Struss, J. Widiez, K. Vladimirova, K. Triantopoulos, H. Beckrich-Ros, M. Vilarrubí, G. Laguna, H. Azarkish, M. Shirazi, J. Michailos

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引用次数: 1

摘要

本文描述了电路环境的演变，以面对日益增加的热挑战，从早期设计阶段到最终封装。为了说明这一关键问题，我们给出了从低功率到高功率电子设备的高效热管理研究的创新技术和概念的描述，重点是热点管理。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Shaping circuit environment to face the thermal challenge Innovative technologies from low to high power electronics

This paper describes evolutions of circuit environment to face an ever-increasing thermal challenge, from early design stage down to the final package. To illustrate this critical concern we give a portrayal of innovative technologies and concepts studied for efficient thermal management from low to high power electronics, with an emphasis on hot spot management.

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2018 IEEE Symposium on VLSI Technology

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