R. Delhougne, A. Arreghini, E. Rosseel, A. Hikavyy, E. Vecchio, L. Zhang, M. Pak, L. Nyns, T. Raymaekers, N. Jossart, L. Breuil, S. S. V-Palayam, C. Tan, G. Van den bosch, A. Furnémont
{"title":"首次展示单晶硅通心粉通道用于3-D NAND存储器器件","authors":"R. Delhougne, A. Arreghini, E. Rosseel, A. Hikavyy, E. Vecchio, L. Zhang, M. Pak, L. Nyns, T. Raymaekers, N. Jossart, L. Breuil, S. S. V-Palayam, C. Tan, G. Van den bosch, A. Furnémont","doi":"10.1109/VLSIT.2018.8510635","DOIUrl":null,"url":null,"abstract":"We are demonstrating for the first time epi-based monocrystalline silicon macaroni channel 3-D NAND devices. The highly controllable channel replacement process sequence leads to > 95% yield, with excellent uniformity and reproducibility, proving its potential for manufacturability. The electron mobility of the channel is improved by a factor 30 compared to the polycrystalline macaroni Si channel, together with a reduction of the off state leakage. Furthermore, this channel replacement fabrication process does not affect memory performance and reliability. The performance benefits of this channel replacement technique make it a potential candidate for fabricating future 3-D NAND devices.","PeriodicalId":6561,"journal":{"name":"2018 IEEE Symposium on VLSI Technology","volume":"40 1","pages":"203-204"},"PeriodicalIF":0.0000,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"First demonstration of monocrystalline silicon macaroni channel for 3-D NAND memory devices\",\"authors\":\"R. Delhougne, A. Arreghini, E. Rosseel, A. Hikavyy, E. Vecchio, L. Zhang, M. Pak, L. Nyns, T. Raymaekers, N. Jossart, L. Breuil, S. S. V-Palayam, C. Tan, G. Van den bosch, A. Furnémont\",\"doi\":\"10.1109/VLSIT.2018.8510635\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We are demonstrating for the first time epi-based monocrystalline silicon macaroni channel 3-D NAND devices. The highly controllable channel replacement process sequence leads to > 95% yield, with excellent uniformity and reproducibility, proving its potential for manufacturability. The electron mobility of the channel is improved by a factor 30 compared to the polycrystalline macaroni Si channel, together with a reduction of the off state leakage. Furthermore, this channel replacement fabrication process does not affect memory performance and reliability. The performance benefits of this channel replacement technique make it a potential candidate for fabricating future 3-D NAND devices.\",\"PeriodicalId\":6561,\"journal\":{\"name\":\"2018 IEEE Symposium on VLSI Technology\",\"volume\":\"40 1\",\"pages\":\"203-204\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE Symposium on VLSI Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VLSIT.2018.8510635\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE Symposium on VLSI Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.2018.8510635","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
First demonstration of monocrystalline silicon macaroni channel for 3-D NAND memory devices
We are demonstrating for the first time epi-based monocrystalline silicon macaroni channel 3-D NAND devices. The highly controllable channel replacement process sequence leads to > 95% yield, with excellent uniformity and reproducibility, proving its potential for manufacturability. The electron mobility of the channel is improved by a factor 30 compared to the polycrystalline macaroni Si channel, together with a reduction of the off state leakage. Furthermore, this channel replacement fabrication process does not affect memory performance and reliability. The performance benefits of this channel replacement technique make it a potential candidate for fabricating future 3-D NAND devices.