{"title":"图像传感器光学结构的演化","authors":"Nobukazu Teranishi, Hisashi Watanabe, Takehiko Ueda, Naohisa Sengoku","doi":"10.1109/IEDM.2012.6479092","DOIUrl":null,"url":null,"abstract":"On-chip optics in image sensors has played an important role for image sensor pixel shrinkage and image sensor progression on the whole. There are three key functions; light collecting, color filtering and new specific functions, all of which are reviewed with their future trends. For light collecting technologies, 1.12 um pixel FSI (front side illumination) with noble lightpipe, which is suitable for large chief ray angle lenses, is explained.","PeriodicalId":6376,"journal":{"name":"2012 International Electron Devices Meeting","volume":"22 1 1","pages":"24.1.1-24.1.4"},"PeriodicalIF":0.0000,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":"{\"title\":\"Evolution of optical structure in image sensors\",\"authors\":\"Nobukazu Teranishi, Hisashi Watanabe, Takehiko Ueda, Naohisa Sengoku\",\"doi\":\"10.1109/IEDM.2012.6479092\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"On-chip optics in image sensors has played an important role for image sensor pixel shrinkage and image sensor progression on the whole. There are three key functions; light collecting, color filtering and new specific functions, all of which are reviewed with their future trends. For light collecting technologies, 1.12 um pixel FSI (front side illumination) with noble lightpipe, which is suitable for large chief ray angle lenses, is explained.\",\"PeriodicalId\":6376,\"journal\":{\"name\":\"2012 International Electron Devices Meeting\",\"volume\":\"22 1 1\",\"pages\":\"24.1.1-24.1.4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"16\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 International Electron Devices Meeting\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.2012.6479092\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 International Electron Devices Meeting","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2012.6479092","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
On-chip optics in image sensors has played an important role for image sensor pixel shrinkage and image sensor progression on the whole. There are three key functions; light collecting, color filtering and new specific functions, all of which are reviewed with their future trends. For light collecting technologies, 1.12 um pixel FSI (front side illumination) with noble lightpipe, which is suitable for large chief ray angle lenses, is explained.