一种可穿戴式指甲变形传感系统及指尖三维有限元模型

K. Sakuma, B. Webb, R. Narayanan, Avner Abrami, Jeff Rogers, J. Knickerbocker, S. Heisig
{"title":"一种可穿戴式指甲变形传感系统及指尖三维有限元模型","authors":"K. Sakuma, B. Webb, R. Narayanan, Avner Abrami, Jeff Rogers, J. Knickerbocker, S. Heisig","doi":"10.1109/ECTC.2019.00047","DOIUrl":null,"url":null,"abstract":"This paper describes the sensor, electronics, software, modeling, and characterization of a fingernail-mounted RF-connected wearable strain sensor system that measures nail deformation from finger movement. Applications to health monitoring and human computer interfaces in homes, hospitals, and workplaces are discussed. The mechanical deformation of a fingertip pressed or drawn against a plate is demonstrated using a three-dimensional finite-element linear-elastic model to predict the signal level, optimum sensor locations and the type and location of deformation expected for different finger motions. The 3D finite-element linear elastic model is derived from X-ray images of a human finger but generalized and parameterized to allow new models to be created by scaling internal and external parameters such as skin thickness and nail and finger shape to predict sensor system performance for a more general human population. Our analysis finds that a single sensor mounted in the center of the nail will respond to typical grip pressures on the fingertip with readily detectible strain amplitudes but that a multi-sensor array will be sensitive to more general haptic phenomena such as the direction and magnitude of frictional loads and loading of the distal phalangeal joint. It is shown that depending on finger use and loading the nail exhibits shifts in direction, location and sign of strain over the fingernail surface. Measurement data from a simple multi-sensor array is shown to be useful in distinguishing between load conditions, however additional sensors are required for full determination.","PeriodicalId":6726,"journal":{"name":"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)","volume":"23 1","pages":"270-276"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Wearable Fingernail Deformation Sensing System and Three-Dimensional Finite Element Model of Fingertip\",\"authors\":\"K. Sakuma, B. Webb, R. Narayanan, Avner Abrami, Jeff Rogers, J. Knickerbocker, S. Heisig\",\"doi\":\"10.1109/ECTC.2019.00047\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes the sensor, electronics, software, modeling, and characterization of a fingernail-mounted RF-connected wearable strain sensor system that measures nail deformation from finger movement. Applications to health monitoring and human computer interfaces in homes, hospitals, and workplaces are discussed. The mechanical deformation of a fingertip pressed or drawn against a plate is demonstrated using a three-dimensional finite-element linear-elastic model to predict the signal level, optimum sensor locations and the type and location of deformation expected for different finger motions. The 3D finite-element linear elastic model is derived from X-ray images of a human finger but generalized and parameterized to allow new models to be created by scaling internal and external parameters such as skin thickness and nail and finger shape to predict sensor system performance for a more general human population. Our analysis finds that a single sensor mounted in the center of the nail will respond to typical grip pressures on the fingertip with readily detectible strain amplitudes but that a multi-sensor array will be sensitive to more general haptic phenomena such as the direction and magnitude of frictional loads and loading of the distal phalangeal joint. It is shown that depending on finger use and loading the nail exhibits shifts in direction, location and sign of strain over the fingernail surface. Measurement data from a simple multi-sensor array is shown to be useful in distinguishing between load conditions, however additional sensors are required for full determination.\",\"PeriodicalId\":6726,\"journal\":{\"name\":\"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)\",\"volume\":\"23 1\",\"pages\":\"270-276\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-05-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2019.00047\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2019.00047","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

本文描述了传感器,电子,软件,建模和表征的指甲安装射频连接可穿戴应变传感器系统,测量指甲变形的手指运动。讨论了在家庭、医院和工作场所的健康监测和人机界面中的应用。使用三维有限元线弹性模型来预测信号水平,最佳传感器位置以及不同手指运动预期的变形类型和位置,演示了指尖按压或拉伸到板上的机械变形。三维有限元线性弹性模型来源于人类手指的x射线图像,但可以通过缩放内部和外部参数(如皮肤厚度、指甲和手指形状)来创建新模型,从而预测更普通人群的传感器系统性能。我们的分析发现,安装在指甲中心的单个传感器将对典型的指尖握持压力做出反应,并具有易于检测的应变幅度,但多传感器阵列将对更一般的触觉现象敏感,例如摩擦载荷的方向和大小以及远端指骨关节的载荷。结果表明,根据手指的使用和载荷,指甲在方向、位置和指甲表面应变的迹象上发生了变化。测量数据从一个简单的多传感器阵列显示是有用的,以区分负载条件,但额外的传感器需要完全确定。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
A Wearable Fingernail Deformation Sensing System and Three-Dimensional Finite Element Model of Fingertip
This paper describes the sensor, electronics, software, modeling, and characterization of a fingernail-mounted RF-connected wearable strain sensor system that measures nail deformation from finger movement. Applications to health monitoring and human computer interfaces in homes, hospitals, and workplaces are discussed. The mechanical deformation of a fingertip pressed or drawn against a plate is demonstrated using a three-dimensional finite-element linear-elastic model to predict the signal level, optimum sensor locations and the type and location of deformation expected for different finger motions. The 3D finite-element linear elastic model is derived from X-ray images of a human finger but generalized and parameterized to allow new models to be created by scaling internal and external parameters such as skin thickness and nail and finger shape to predict sensor system performance for a more general human population. Our analysis finds that a single sensor mounted in the center of the nail will respond to typical grip pressures on the fingertip with readily detectible strain amplitudes but that a multi-sensor array will be sensitive to more general haptic phenomena such as the direction and magnitude of frictional loads and loading of the distal phalangeal joint. It is shown that depending on finger use and loading the nail exhibits shifts in direction, location and sign of strain over the fingernail surface. Measurement data from a simple multi-sensor array is shown to be useful in distinguishing between load conditions, however additional sensors are required for full determination.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Further Enhancement of Thermal Conductivity through Optimal Uses of h-BN Fillers in Polymer-Based Thermal Interface Material for Power Electronics A Novel Design of a Bandwidth Enhanced Dual-Band Impedance Matching Network with Coupled Line Wave Slowing A New Development of Direct Bonding to Aluminum and Nickel Surfaces by Silver Sintering in air Atmosphere Signal Integrity of Submicron InFO Heterogeneous Integration for High Performance Computing Applications Multilayer Glass Substrate with High Density Via Structure for All Inorganic Multi-chip Module
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1