Shihua Yang, Chunqing Wang, Yanhong Tian, P. Lin, Le Liang
{"title":"小型化Sn-Ag-Cu焊点β-Sn晶粒数限制","authors":"Shihua Yang, Chunqing Wang, Yanhong Tian, P. Lin, Le Liang","doi":"10.1109/ICEPT.2008.4607056","DOIUrl":null,"url":null,"abstract":"As-reflowed Sn-Ag-Cu solder joints in various diameters were found to contain only several beta-Sn crystal grains. With the solder joints increasingly miniaturized, there is no obvious change in the grain number in a solder joint. The aged Sn-Ag-Cu solder joints are composed of very limited number of beta-Sn crystal grains as well. It appears that the solder joint size and thermal aging have less influence on the growth of beta-Sn grains.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":"131 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Limited β-Sn grain number of miniaturized Sn-Ag-Cu solder joints\",\"authors\":\"Shihua Yang, Chunqing Wang, Yanhong Tian, P. Lin, Le Liang\",\"doi\":\"10.1109/ICEPT.2008.4607056\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As-reflowed Sn-Ag-Cu solder joints in various diameters were found to contain only several beta-Sn crystal grains. With the solder joints increasingly miniaturized, there is no obvious change in the grain number in a solder joint. The aged Sn-Ag-Cu solder joints are composed of very limited number of beta-Sn crystal grains as well. It appears that the solder joint size and thermal aging have less influence on the growth of beta-Sn grains.\",\"PeriodicalId\":6324,\"journal\":{\"name\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"volume\":\"131 1\",\"pages\":\"1-3\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-07-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2008.4607056\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2008.4607056","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Limited β-Sn grain number of miniaturized Sn-Ag-Cu solder joints
As-reflowed Sn-Ag-Cu solder joints in various diameters were found to contain only several beta-Sn crystal grains. With the solder joints increasingly miniaturized, there is no obvious change in the grain number in a solder joint. The aged Sn-Ag-Cu solder joints are composed of very limited number of beta-Sn crystal grains as well. It appears that the solder joint size and thermal aging have less influence on the growth of beta-Sn grains.
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