{"title":"SiP设备上的DPA测试","authors":"Jin Ling, H. Jun, Han Li","doi":"10.1109/ICEPT.2008.4606953","DOIUrl":null,"url":null,"abstract":"The reliability of multi-dice in package was studied in this paper; DPA tests were operated on qualified devices to distribute early failure from overstress failure. Then factorial experiments manipulated on early failure samples for failure analysis. Comparing the C-SAM images before and after a series reliability tests, the reliability of SiP devices was confirmed.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":"22 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"DPA tests on SiP device\",\"authors\":\"Jin Ling, H. Jun, Han Li\",\"doi\":\"10.1109/ICEPT.2008.4606953\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The reliability of multi-dice in package was studied in this paper; DPA tests were operated on qualified devices to distribute early failure from overstress failure. Then factorial experiments manipulated on early failure samples for failure analysis. Comparing the C-SAM images before and after a series reliability tests, the reliability of SiP devices was confirmed.\",\"PeriodicalId\":6324,\"journal\":{\"name\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"volume\":\"22 1\",\"pages\":\"1-3\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-07-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2008.4606953\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2008.4606953","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The reliability of multi-dice in package was studied in this paper; DPA tests were operated on qualified devices to distribute early failure from overstress failure. Then factorial experiments manipulated on early failure samples for failure analysis. Comparing the C-SAM images before and after a series reliability tests, the reliability of SiP devices was confirmed.
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