{"title":"射频/数字SOP中采用新型分段电源总线结构提高电源完整性","authors":"Jun Li, L. Wan, Wei Gao, C. Liao","doi":"10.1109/ICEPT.2008.4606977","DOIUrl":null,"url":null,"abstract":"With the voltage decreasing in power distribution network (PDN) in system-on-packages (SOPs), power integrity will be a critical issue. The cavity resonance modes between power and ground planes can be excited by simultaneous switching noise (SSN) or ground bounce noise (GBN) [1], [2]. To cut down the noise from susceptible devices, isolation techniques are necessary. In this paper, two novel structures combine segmented method and embedded capacitor provided isolation performances from 0.7 GHz to 10 GHz below -40 dB. The novel structures with a bridge for suppressing noise in high frequency and a thin high K dielectric substrate for decreasing the SSN in the entire frequency band. And they were better in performance and simpler in configuration than Electromagnetic Band Gap (EBG) and other isolation structures. Moreover, the analytical process could be a guidance to find better structures for improving the noise isolation.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":"1 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Improvement of power integrity with novel segmented power bus structures in RF/digital SOP\",\"authors\":\"Jun Li, L. Wan, Wei Gao, C. Liao\",\"doi\":\"10.1109/ICEPT.2008.4606977\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"With the voltage decreasing in power distribution network (PDN) in system-on-packages (SOPs), power integrity will be a critical issue. The cavity resonance modes between power and ground planes can be excited by simultaneous switching noise (SSN) or ground bounce noise (GBN) [1], [2]. To cut down the noise from susceptible devices, isolation techniques are necessary. In this paper, two novel structures combine segmented method and embedded capacitor provided isolation performances from 0.7 GHz to 10 GHz below -40 dB. The novel structures with a bridge for suppressing noise in high frequency and a thin high K dielectric substrate for decreasing the SSN in the entire frequency band. And they were better in performance and simpler in configuration than Electromagnetic Band Gap (EBG) and other isolation structures. Moreover, the analytical process could be a guidance to find better structures for improving the noise isolation.\",\"PeriodicalId\":6324,\"journal\":{\"name\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"volume\":\"1 1\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-07-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2008.4606977\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2008.4606977","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Improvement of power integrity with novel segmented power bus structures in RF/digital SOP
With the voltage decreasing in power distribution network (PDN) in system-on-packages (SOPs), power integrity will be a critical issue. The cavity resonance modes between power and ground planes can be excited by simultaneous switching noise (SSN) or ground bounce noise (GBN) [1], [2]. To cut down the noise from susceptible devices, isolation techniques are necessary. In this paper, two novel structures combine segmented method and embedded capacitor provided isolation performances from 0.7 GHz to 10 GHz below -40 dB. The novel structures with a bridge for suppressing noise in high frequency and a thin high K dielectric substrate for decreasing the SSN in the entire frequency band. And they were better in performance and simpler in configuration than Electromagnetic Band Gap (EBG) and other isolation structures. Moreover, the analytical process could be a guidance to find better structures for improving the noise isolation.