非导电膜(nfc)的固化性能和粘度对锡银凸点形貌和可靠性的影响

2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Pub Date : 2019-05-01 DOI:10.1109/ECTC.2019.000-5

Hanmin Lee, Seyong Lee, Sangmyung Shin, Taejin Choi, SooIn Park, K. Paik

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引用次数: 3

摘要

在这项研究中，使用nfc对锡银焊料凸点进行了评估。采用等温热压缩(TC)键合方法进行倒装芯片键合5秒。通过使用固化剂和二氧化硅含量来调整凹凸焊点的固化性能，如固化起始时间、峰值温度、nfc的固化程度和粘度。然后，利用不同焊接温度和黏度下的固化度测量值，对nfc在焊料熔化温度下的精确黏度进行了近似固化和黏度计算。最后，通过高温高湿试验(85 rh %/85℃试验)和温度循环试验(T/C)对不同焊点的热-机械可靠性性能进行了评价。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Effects of the Curing Properties and Viscosities of Non-Conductive Films (NCFs) on the Sn-Ag Solder Bump Joint Morphology and Reliability

In this study, solder bump flip chip assembly using NCFs was evaluated for Sn-Ag solder bumps. Flip chip bonding was performed using an isothermal Thermo-Compression (TC) bonding method for 5 seconds. Solder bump joints were evaluated by adjusting the curing properties such as curing onset, peak temperature, and degree of curing and viscosities of NCFs using curing agents and silica contents. And then, the degree of cure and viscosity approximations were conducted to define the precise viscosity of NCFs at the solder melting temperature using measured degree of cures at various bonding temperatures and viscosities. Finally, high temperature and humidity test (85RH%/85°C test) and temperature cycling (T/C) test were performed to evaluate the thermo-mechanical reliability performance depending on solder joint.

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2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

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