{"title":"金丝粘结破坏拉拔试验及其不对称分布的性能研究","authors":"Jin Peng","doi":"10.1109/ICEPT.2008.4607119","DOIUrl":null,"url":null,"abstract":"The statistical process control (SPC) of destructive pull test on 1 Au gold wire is studied on two high-rel devices, namely #1 and #2. It was found that the Cpk of both parts are around 1.2, which have not meet our goal of 1.33 and the ultimately six sigma (Cpk= 2). However, this study shows that the traditional method of calculating Cpk has underestimated the capability of process control if considering the tolerance as asymmetric, such as the case for 1 mil gold wire bond.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Capability study on the destructive pull test of 1 mil gold wire bond and its asymmetric distribution\",\"authors\":\"Jin Peng\",\"doi\":\"10.1109/ICEPT.2008.4607119\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The statistical process control (SPC) of destructive pull test on 1 Au gold wire is studied on two high-rel devices, namely #1 and #2. It was found that the Cpk of both parts are around 1.2, which have not meet our goal of 1.33 and the ultimately six sigma (Cpk= 2). However, this study shows that the traditional method of calculating Cpk has underestimated the capability of process control if considering the tolerance as asymmetric, such as the case for 1 mil gold wire bond.\",\"PeriodicalId\":6324,\"journal\":{\"name\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-07-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2008.4607119\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2008.4607119","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Capability study on the destructive pull test of 1 mil gold wire bond and its asymmetric distribution
The statistical process control (SPC) of destructive pull test on 1 Au gold wire is studied on two high-rel devices, namely #1 and #2. It was found that the Cpk of both parts are around 1.2, which have not meet our goal of 1.33 and the ultimately six sigma (Cpk= 2). However, this study shows that the traditional method of calculating Cpk has underestimated the capability of process control if considering the tolerance as asymmetric, such as the case for 1 mil gold wire bond.
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