采用MOCVD在Si衬底上生长30nm增强模式In0.53Ga0.47As mosfet,具有高跨导性和低导通电阻

Xiuju Zhou, Qiang Li, C. Tang, K. Lau
{"title":"采用MOCVD在Si衬底上生长30nm增强模式In0.53Ga0.47As mosfet,具有高跨导性和低导通电阻","authors":"Xiuju Zhou, Qiang Li, C. Tang, K. Lau","doi":"10.1109/IEDM.2012.6479153","DOIUrl":null,"url":null,"abstract":"This paper describes the development of 30nm enhancement-mode In<sub>0.53</sub>Ga<sub>0.47</sub>As MOSFETs grown on Si substrates featuring Al<sub>2</sub>O<sub>3</sub>/InAlAs composite gate stack with extrinsic transconductance of 1700mS/mm at V<sub>ds</sub>=0.5V and on-resistance of 157 Ω·μm. A low-temperature process of post metallization annealing has been developed to achieve enhancement-mode operation. Capacitance-Voltage measurements and TEM observation were carried out to investigate the mechanisms of threshold voltage shift. Furthermore, device scalability down to 30nm is reported.","PeriodicalId":6376,"journal":{"name":"2012 International Electron Devices Meeting","volume":"69 1","pages":"32.5.1-32.5.4"},"PeriodicalIF":0.0000,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"18","resultStr":"{\"title\":\"30nm enhancement-mode In0.53Ga0.47As MOSFETs on Si substrates grown by MOCVD exhibiting high transconductance and low on-resistance\",\"authors\":\"Xiuju Zhou, Qiang Li, C. Tang, K. Lau\",\"doi\":\"10.1109/IEDM.2012.6479153\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes the development of 30nm enhancement-mode In<sub>0.53</sub>Ga<sub>0.47</sub>As MOSFETs grown on Si substrates featuring Al<sub>2</sub>O<sub>3</sub>/InAlAs composite gate stack with extrinsic transconductance of 1700mS/mm at V<sub>ds</sub>=0.5V and on-resistance of 157 Ω·μm. A low-temperature process of post metallization annealing has been developed to achieve enhancement-mode operation. Capacitance-Voltage measurements and TEM observation were carried out to investigate the mechanisms of threshold voltage shift. Furthermore, device scalability down to 30nm is reported.\",\"PeriodicalId\":6376,\"journal\":{\"name\":\"2012 International Electron Devices Meeting\",\"volume\":\"69 1\",\"pages\":\"32.5.1-32.5.4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"18\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 International Electron Devices Meeting\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.2012.6479153\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 International Electron Devices Meeting","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2012.6479153","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 18

摘要

本文描述了在Si衬底上生长的30nm增强模式In0.53Ga0.47As mosfet的开发,该mosfet采用Al2O3/InAlAs复合栅极堆叠,在Vds=0.5V时的外在跨导为1700mS/mm,导通电阻为157 Ω·μm。为了实现增强模式操作,开发了一种金属化后低温退火工艺。通过电容电压测量和透射电镜观察,探讨了阈值电压漂移的机理。此外,器件可扩展性低至30nm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
30nm enhancement-mode In0.53Ga0.47As MOSFETs on Si substrates grown by MOCVD exhibiting high transconductance and low on-resistance
This paper describes the development of 30nm enhancement-mode In0.53Ga0.47As MOSFETs grown on Si substrates featuring Al2O3/InAlAs composite gate stack with extrinsic transconductance of 1700mS/mm at Vds=0.5V and on-resistance of 157 Ω·μm. A low-temperature process of post metallization annealing has been developed to achieve enhancement-mode operation. Capacitance-Voltage measurements and TEM observation were carried out to investigate the mechanisms of threshold voltage shift. Furthermore, device scalability down to 30nm is reported.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
On the degradation of field-plate assisted RESURF power devices Effective Schottky Barrier Height modulation using dielectric dipoles for source/drain specific contact resistivity improvement Study of piezoresistive properties of advanced CMOS transistors: Thin film SOI, SiGe/SOI, unstrained and strained Tri-Gate Nanowires Design and performance of pseudo-spin-MOSFETs using nano-CMOS devices MOSFET performance and scalability enhancement by insertion of oxygen layers
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1