用于覆盖28GHz和39GHz范围的5G毫米波超宽带双极化天线的新型多核PCB和基板解决方案

T. Thai, S. Dalmia, Josef Hagn, Pouya Talebbeydokhti, Yossi Tsfati
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引用次数: 11

摘要

实现Gbps数据通道的5G毫米波(mmWave)通信通常需要在多频率范围(27- 30ghz和37-40GHz)内采用双极化的宽带操作。此外,接入点和基站需要大型高增益天线阵列和跨工作频率的一致辐射模式,以便于波束扫描控制。提出了采用叠置贴片天线作为解决方案。然而,宽带贴片天线需要厚衬底和多层。对于标准基板技术的大批量生产和可接受的良率,这种针对消费市场的解决方案以前没有尝试过。在这项工作中,我们提出了一种新颖的多核封装方法,以实现基于标准PCB/基板技术的独特且具有成本效益的解决方案。我们用一个尺寸为30mm x 50mm x 1.5mm的完整毫米波射频模块板来演示这一点。它由4 × 8单元的大面积双极化双频(28GHz和39GHz)堆叠贴片天线阵列和完全集成的系统级封装(sip)以及所有热学和机械功能组成。该方案实现了非常高的交叉极化鉴别比(>25dB),这对双极化网络的MIMO操作至关重要。该工作包括验证适合低成本毫米波5G CPE(客户端设备)和基站应用的设计和封装概念的测量。
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Novel Multicore PCB and Substrate Solutions for Ultra Broadband Dual Polarized Antennas for 5G Millimeter Wave Covering 28GHz & 39GHz Range
5G millimeter wave (mmWave) communications that enables Gbps data channels often require broadband operation with dual polarization in multi frequency ranges (27-30, and 37-40GHz). Additionally, access points and base stations need large high gain antenna arrays and consistent radiation patterns across operation frequencies for ease of beam scanning control. Many stacked patch antennas were proposed as the solution. However, broadband patch antennas require thick substrate and multiple layers. For high volume production in standard substrate technology with acceptable yield, such solution targeting the consumer market has not been attempted previously. In this work, we present a novel multicore packaging approach to realize a unique and cost effective solution based on standard PCB/ Substrate technology. We demonstrate this with a complete mmWave RF module board with dimensions of 30mm x 50mm x 1.5mm. It consists of a large area dual polarization dual frequency (28GHz and 39GHz) stacked patch antenna array of 4x8 elements and fully integrated Systems-In-Package (SIPs) along with all the thermal and mechanical functions. This solution achieves a very high cross polarization discrimination ratio (>25dB), which is critical in the MIMO operation of the dual polarization network. The work includes measurements to validate the design and the packaging concept suitable for low cost mmWave 5G CPE (Customer Premises Equipment) and base station applications.
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