A new method for the investigation of strip warpage of MAP-QFN

Electronic package plays an important part in the development of IC industry. As we all known, strip warpage is a critical issue for the MAP-QFN manufacturing, results from the package structure, the thermal mismatch of materials and the manufacturing process. In this paper, a new finite element model was used to predict the warpage of one MAP-QFN block. And in this model, the temperature-dependent parameters of materials were characterized by DMA and DSC measurements, and the boundary condition was set up to be close to the real deforming situation. Furthermore, by the geometric triangle principle, the calculated warpage was also verified with the experiment measurement data. Finally we accomplished the optimization of related package parameters, and decreased the warpage of MAP-QFN by applying the dead weight on the strip block in the post mould curing process.