非循环顺序电路中过渡故障的组合测试生成

Shi Hui, Ran Feng, Zhang Jinyi
{"title":"非循环顺序电路中过渡故障的组合测试生成","authors":"Shi Hui, Ran Feng, Zhang Jinyi","doi":"10.1109/ICEPT.2008.4607015","DOIUrl":null,"url":null,"abstract":"This paper presents a combinational test generation method for transition faults in acyclic sequential circuits. In this method, to generate test sequences for transition faults in a given acyclic sequential circuit is performed on its extend time-expansion model. The model is composed of two copies of time-expansion model of the given circuit and extends in the close two sequences to generate 2 vectors for the transition faults with some restrictions. Experimental results show the method can achieve the higher fault efficiency with the lower test generation times than conventional method.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":"103 1","pages":"1-5"},"PeriodicalIF":0.0000,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Combinational test generation for transition faults in acyclic sequential circuits\",\"authors\":\"Shi Hui, Ran Feng, Zhang Jinyi\",\"doi\":\"10.1109/ICEPT.2008.4607015\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a combinational test generation method for transition faults in acyclic sequential circuits. In this method, to generate test sequences for transition faults in a given acyclic sequential circuit is performed on its extend time-expansion model. The model is composed of two copies of time-expansion model of the given circuit and extends in the close two sequences to generate 2 vectors for the transition faults with some restrictions. Experimental results show the method can achieve the higher fault efficiency with the lower test generation times than conventional method.\",\"PeriodicalId\":6324,\"journal\":{\"name\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"volume\":\"103 1\",\"pages\":\"1-5\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-07-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2008.4607015\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2008.4607015","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

提出了一种非循环顺序电路过渡故障的组合测试生成方法。该方法在给定的非循环时序电路的扩展时间展开模型上生成过渡故障的测试序列。该模型由给定电路的时间展开模型的两个副本组成,并在闭合的两个序列中进行扩展,生成两个具有一定限制的过渡故障向量。实验结果表明,与传统方法相比,该方法能以更少的测试生成次数获得更高的故障效率。
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Combinational test generation for transition faults in acyclic sequential circuits
This paper presents a combinational test generation method for transition faults in acyclic sequential circuits. In this method, to generate test sequences for transition faults in a given acyclic sequential circuit is performed on its extend time-expansion model. The model is composed of two copies of time-expansion model of the given circuit and extends in the close two sequences to generate 2 vectors for the transition faults with some restrictions. Experimental results show the method can achieve the higher fault efficiency with the lower test generation times than conventional method.
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