{"title":"板级电子封装动态弯曲试验及数值模拟","authors":"Q. Fei, Wang Yngve, Liu Bin, An Tong, J. Ling","doi":"10.1109/ICEPT.2008.4606969","DOIUrl":null,"url":null,"abstract":"4-point dynamic bending tests of board level electronic packages were carried out in order to investigate the reliability of solder joints. A high speed camera and the digital image correlation method were used to measure the deflection of the PCB board. A finite element model to simulate the test was built up and was validated by the test data. A parameter study was subsequently implemented. The results show that at certain value of PCB stiffness the peeling stress reaches its peak. The package installation angel has significant effect on the peeling stress of the solder joints.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":"16 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Dynamic bending tests and numerical simulation of board level electronic package\",\"authors\":\"Q. Fei, Wang Yngve, Liu Bin, An Tong, J. Ling\",\"doi\":\"10.1109/ICEPT.2008.4606969\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"4-point dynamic bending tests of board level electronic packages were carried out in order to investigate the reliability of solder joints. A high speed camera and the digital image correlation method were used to measure the deflection of the PCB board. A finite element model to simulate the test was built up and was validated by the test data. A parameter study was subsequently implemented. The results show that at certain value of PCB stiffness the peeling stress reaches its peak. The package installation angel has significant effect on the peeling stress of the solder joints.\",\"PeriodicalId\":6324,\"journal\":{\"name\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"volume\":\"16 1\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-07-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2008.4606969\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2008.4606969","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Dynamic bending tests and numerical simulation of board level electronic package
4-point dynamic bending tests of board level electronic packages were carried out in order to investigate the reliability of solder joints. A high speed camera and the digital image correlation method were used to measure the deflection of the PCB board. A finite element model to simulate the test was built up and was validated by the test data. A parameter study was subsequently implemented. The results show that at certain value of PCB stiffness the peeling stress reaches its peak. The package installation angel has significant effect on the peeling stress of the solder joints.
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