热管理研究-从电力电子到便携设备

K. Jung, Chi Zhang, Tanya Liu, M. Asheghi, K. Goodson
{"title":"热管理研究-从电力电子到便携设备","authors":"K. Jung, Chi Zhang, Tanya Liu, M. Asheghi, K. Goodson","doi":"10.1109/VLSIT.2018.8510678","DOIUrl":null,"url":null,"abstract":"Thermal management is critical for electronic systems ranging from servers and smartphones to radar HEMTs and hybrid vehicle converters. Rapid research progress is being achieved both on-chip and in packaging through new materials and microfluidics. One very promising area is thermal metamaterials, which offer unusual combinations of thermal, mechanical, fluidic, and other properties by means of micro- or nanoscale heterogeneity, porosity, and/or layering. Another area is the upscaling of the performance and efficiency of fluidic systems – both capillary-based and pumped, which remove heat to an external heat rejector. This talk summarizes progress and highlights collaborations with the semiconductor industry, US defense companies and the NSF center on power electronics (POETS).","PeriodicalId":6561,"journal":{"name":"2018 IEEE Symposium on VLSI Technology","volume":"25 1","pages":"17-18"},"PeriodicalIF":0.0000,"publicationDate":"2018-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Thermal Management Research – from Power Electronics to Portables\",\"authors\":\"K. Jung, Chi Zhang, Tanya Liu, M. Asheghi, K. Goodson\",\"doi\":\"10.1109/VLSIT.2018.8510678\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Thermal management is critical for electronic systems ranging from servers and smartphones to radar HEMTs and hybrid vehicle converters. Rapid research progress is being achieved both on-chip and in packaging through new materials and microfluidics. One very promising area is thermal metamaterials, which offer unusual combinations of thermal, mechanical, fluidic, and other properties by means of micro- or nanoscale heterogeneity, porosity, and/or layering. Another area is the upscaling of the performance and efficiency of fluidic systems – both capillary-based and pumped, which remove heat to an external heat rejector. This talk summarizes progress and highlights collaborations with the semiconductor industry, US defense companies and the NSF center on power electronics (POETS).\",\"PeriodicalId\":6561,\"journal\":{\"name\":\"2018 IEEE Symposium on VLSI Technology\",\"volume\":\"25 1\",\"pages\":\"17-18\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2018 IEEE Symposium on VLSI Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VLSIT.2018.8510678\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE Symposium on VLSI Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.2018.8510678","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

从服务器和智能手机到雷达hemt和混合动力汽车转换器,热管理对电子系统至关重要。通过新材料和微流体技术,芯片和封装领域的研究取得了快速进展。一个非常有前途的领域是热超材料,它通过微或纳米尺度的非均质性、孔隙度和/或分层,提供了热、机械、流体和其他特性的不同寻常的组合。另一个领域是流体系统的性能和效率的提升——包括基于毛细管的和泵送的,它们将热量转移到外部热分离器。这次演讲总结了进展,并强调了与半导体工业,美国国防公司和国家科学基金会电力电子中心(诗人)的合作。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Thermal Management Research – from Power Electronics to Portables
Thermal management is critical for electronic systems ranging from servers and smartphones to radar HEMTs and hybrid vehicle converters. Rapid research progress is being achieved both on-chip and in packaging through new materials and microfluidics. One very promising area is thermal metamaterials, which offer unusual combinations of thermal, mechanical, fluidic, and other properties by means of micro- or nanoscale heterogeneity, porosity, and/or layering. Another area is the upscaling of the performance and efficiency of fluidic systems – both capillary-based and pumped, which remove heat to an external heat rejector. This talk summarizes progress and highlights collaborations with the semiconductor industry, US defense companies and the NSF center on power electronics (POETS).
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Low RA Magnetic Tunnel Junction Arrays in Conjunction with Low Switching Current and High Breakdown Voltage for STT-MRAM at 10 nm and Beyond A Circuit Compatible Accurate Compact Model for Ferroelectric-FETs A Threshold Switch Augmented Hybrid-FeFET (H-FeFET) with Enhanced Read Distinguishability and Reduced Programming Voltage for Non-Volatile Memory Applications Sensors and related devices for IoT, medicine and s mart-living A Comprehensive Study of Polymorphic Phase Distribution of Ferroelectric-Dielectrics and Interfacial Layer Effects on Negative Capacitance FETs for Sub-5 nm Node
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1