{"title":"SnAgCu焊点塑性损伤力学本构模型研究","authors":"Xiaoyan Li, Yongchang Yan, Na Liu","doi":"10.1109/ICEPT.2008.4607158","DOIUrl":null,"url":null,"abstract":"A thermodynamics-based damage mechanics rate dependent constitutive model is used to simulate experiments conducted on thin layer eutectic SnAgCu(SAC) solder joints. The non-damage constitutive is measured by bulk tensile test. The relationship between true stress and strain is sigma=85.26epsiv0.3536. Damage evolution equation is proposed based Lemaitre ductile damage theory and the constant in the equation is measured by unloading elastic modulus method. The damage evolution equation is D=1.0689epsivP-0.0008. Simulation (using software Ansys 9.0) of shear test of solder joint between Cu sticks employing damage mechanics rate independent constitutive is uniform to practicable test.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":"56 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Study of plasticity damage mechanics constitutive model for SnAgCu solder joint\",\"authors\":\"Xiaoyan Li, Yongchang Yan, Na Liu\",\"doi\":\"10.1109/ICEPT.2008.4607158\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A thermodynamics-based damage mechanics rate dependent constitutive model is used to simulate experiments conducted on thin layer eutectic SnAgCu(SAC) solder joints. The non-damage constitutive is measured by bulk tensile test. The relationship between true stress and strain is sigma=85.26epsiv0.3536. Damage evolution equation is proposed based Lemaitre ductile damage theory and the constant in the equation is measured by unloading elastic modulus method. The damage evolution equation is D=1.0689epsivP-0.0008. Simulation (using software Ansys 9.0) of shear test of solder joint between Cu sticks employing damage mechanics rate independent constitutive is uniform to practicable test.\",\"PeriodicalId\":6324,\"journal\":{\"name\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"volume\":\"56 1\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-07-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2008.4607158\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2008.4607158","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Study of plasticity damage mechanics constitutive model for SnAgCu solder joint
A thermodynamics-based damage mechanics rate dependent constitutive model is used to simulate experiments conducted on thin layer eutectic SnAgCu(SAC) solder joints. The non-damage constitutive is measured by bulk tensile test. The relationship between true stress and strain is sigma=85.26epsiv0.3536. Damage evolution equation is proposed based Lemaitre ductile damage theory and the constant in the equation is measured by unloading elastic modulus method. The damage evolution equation is D=1.0689epsivP-0.0008. Simulation (using software Ansys 9.0) of shear test of solder joint between Cu sticks employing damage mechanics rate independent constitutive is uniform to practicable test.
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