模拟和射频电路设计和未来的设备交互

A. Matsuzawa
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引用次数: 10

摘要

本文综述和讨论了模拟和射频电路设计的最新进展以及未来器件的交互,重点介绍了毫米波射频电路和adc。随着CMOS技术的缩放,fT和fmax都增加了。采用先进的CMOS工艺和技术,如负电容、增益平坦化、传输线精确阻抗匹配、注入锁定等,实现了60 GHz的CMOS收发器。采用16qam方式实现16gbps的数据传输。动态比较器采用电容式数字偏置电压补偿的动态前置放大器,实现了小失配电压、低噪声、低功耗、低电压的工作,无任何静态电流。Flash adc和使用动态比较器的SAR adc已经取得了进展。该插值方法可以降低流水线adc对运放的增益要求。为实现低损耗传输线和高密度大电容比MOM电容器,应考虑互连结构。
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Analog and RF circuits design and future devices interaction
This paper reviews and discusses the recent progress of analog and RF circuits design and the future devices interaction, focusing on the millimeter wave RF circuits and ADCs. With the scaling of CMOS technology, fT and fmax are increased. Using an advanced CMOS process and techniques such as the negative capacitance, the gain flattening, the accurate impedance matching using transmission lines, and the injection locking, a 60 GHz CMOS transceiver is realized. It attains 16 Gbps data transmission with the 16 QAM method. A dynamic comparator using a dynamic pre-amplifier with capacitive digital offset voltage compensation realizes a small mismatch voltage, low noise, low power, and low voltage operation without any static current. Flash ADCs and SAR ADCs using dynamic comparators have progressed. The interpolation method can ease the gain requirement for OpAmp in pipelined ADCs. The interconnection structure should be considered to realize low loss transmission lines and high density and large capacitance ratio MOM capacitors.
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