BGA封装中Sn96.7-Ag3.7聚合物芯焊料球的跌落试验

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI:10.1109/IMPACT.2011.6117247

Tien-Tsorng Shih, Binghua Chen, Win-Der Lee, Mu-Chun Wang

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引用次数: 1

摘要

从成本考虑，在球栅阵列(BGA)封装中使用聚合物芯焊锡球代替固体焊锡球是一种可行的选择。除了考虑焊料球与载体衬底之间的金属间化合物(IMC)外，还需要进行跌落试验的可靠性试验。在商业规范测试条件下，这个候选程序展示了令人印象深刻的性能。试验结果的均匀性也优于对照组。采用Weibull分布的斜率值和尺度参数进行统计计算，说明BGA封装的聚合物芯焊料球具有良好的耐轰击性能，并结合ENEPIG基材表面处理配方。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Drop test for Sn96.7-Ag3.7 polymer core solder ball in BGA package

Using polymer core solder ball in ball-grid-array (BGA) package instead of solid solder ball in cost consideration is a feasible choice. Besides the consideration for inter-metallic compound (IMC) between solder ball and carrier substrate, the reliability test for drop test is necessary. Following the commercial specification test conditions, this candidate demonstrates an impressive performance. The uniformity for the test results is also better than that with the control group. The slope value and scale parameter of Weibull distribution adopted in this statistic calculation illustrated the polymer core solder ball in BGA package owned the wonderful bombardment endurance capability, incorporated with the ENEPIG processing recipe for substrate metal finish.

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2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

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